Die folgenden Begriffe wurden einbezogen:
平板培養, Ausplattierung, plating
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2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: S. 6481-6484; ISBN 978-1-5386-1312-2
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2019 IEEE 15th International Colloquium on Signal Processing & Its Applications (CSPA), Penang, Malaysia. IEEE: S. 147-151; ISBN 978-1-5386-7564-9
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2018,
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2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: S. 1-2; ISBN 978-1-5386-5922-9
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