Die folgenden Begriffe wurden einbezogen:
thermisch, thermal, thermic, 熱の
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2021,
Lan Q, Guo R, Chang J, Zheng J, Yu K, Chen J
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: 4159-4162; ISBN 978-1-7281-1180-3
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2021,
Tanrıverdi V, Gençer NG
[2021 Medical Technologies Congress (TIPTEKNO)], Antalya, Turkey. IEEE: 1-4; ISBN 978-1-6654-3663-2
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2021,
Guo R, Zheng J, Xia M, Jiang G, Shrivastava D, Kainz W, Chen J
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: 1527-1530; ISBN 978-1-7281-1179-7
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2021,
Zheng C, Chen X, Nguyen BT, Sanpitak P, Vu J, Bagci U, Golestanirad L
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: 4204-4208; ISBN 978-1-7281-1179-7
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2021,
Kumar S, Pal A, Jain S, Velpandian T, Mathur R
Brain Sci 11 (11): 1431
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2021,
Hikage T, Ozaki R, Ishitake T, Masuda H
Front Public Health 9: 77712
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2021,
Afaghi P, Lapolla MA, Ghandi K
Sci Rep 11: 23373
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2021,
Kwon SH, Na JI, Huh CH, Park KC
Ann Dermatol 33 (6): 522-530
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2021,
Wooldridge J, Arduino A, Zilberti L, Zanovello U, Chiampi M, Clementi V, Bottauscio O
Phys Med Biol 66 (24): 245024
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2021,
Sitnikov DS, Ilina IV, Revkova VA, Rodionov SA, Gurova SA, Shatalova RO, Kovalev AV, Ovchinnikov AV, Chefonov OV, Konoplyannikov MA, Kalsin VA, Baklaushev VP
Biomed Opt Express 12 (11): 7122-7138
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2021,
Li K, Diao Y, Sasaki K, Prokop A, Poljak D, Doric V, Xi J, Kodera S, Hirata A, El Hajj W
IEEE Access 9: 151654-151666
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2021,
Nevezhin V, Busygina A
2021 IEEE 22nd International Conference of Young Professionals in Electron Devices and Materials (EDM), Souzga, the Altai Republic, Russia. IEEE: 403-406; ISBN 978-1-6654-3056-2
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2021,
Barati M, Darvishi B, Javidi MA, Mohammadian A, Shariatpanahi SP, Eisavand MR, Madjid Ansari A
Cell Prolif 54 (12): e13154
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2021,
Rajput JL, Nandgaonkar AB, Nalbalwar SL, Wagh AE, Munde MM, Huilgol NG
2021 IEEE 4th International Conference on Computing, Power and Communication Technologies (GUCON), Kuala Lumpur, Malaysia. IEEE: 1-6; ISBN 978-1-7281-9952-8
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2021,
Diatroptov ME, Diatroptova MA
Bull Exp Biol Med 171 (6): 783-788
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2021,
Ge Z, Zhou J, Rao X, Zhu Z, Wu D, Li P, Zhang P, Li M
2021 46th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz), Chengdu, China. IEEE: 1-2; ISBN 978-1-7281-9425-7
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2021,
Kasprzycka W, Trębińska-Stryjewska A, Lewandowski RB, Stępińska M, Osuchowska PN, Dobrzyńska M, Achour Y, Osuchowski ŁP, Starzyński J, Mierczyk Z, Trafny EA
Int J Mol Sci 22 (20): 11236
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2021,
Lan J, Sun X, Zhu H, Cao X, Yang L, Du G
IEEE Access 9: 54152-54158
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2021,
Xin Z, Kuwahata A, Liu S, Sekino M
Front Hum Neurosci 15: 693207
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2021,
Maluin SM, Osman K, Jaffar FHF, Ibrahim SF
Front Physiol 12: 732420
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2021,
Andersen E, Casados C, Truong BD, Roundy S
IEEE Trans Electromagn Compat 63 (5): 1735-1747
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2021,
Panagopoulos DJ, Karabarbounis A, Yakymenko I, Chrousos GP
Int J Oncol 59 (5): 92
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2021,
Cherkasova OP, Serdyukov DS, Nemova EF, Ratushnyak AS, Kucheryavenko AS, Dolganova IN, Xu G, Skorobogatiy M, Reshetov IV, Timashev PS, Spektor IE, Zaytsev KI, Tuchin VV
J Biomed Opt 26 (9)
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2021,
Carr IA, Garcia M, Cordray D, Lee A, Shrivastava D, Hariharan P
Biomed Phys Eng Express 7 (6): 065022
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2021,
Sasaki K, Kawabata K, Shimizu Y, Watanabe S, Wake K, Suga R, Hashimoto O
IEEE Trans Electromagn Compat 63 (5): 1631-1639