Die folgenden Begriffe wurden einbezogen:
電磁気の, elektromagnetisch, electromagnetic
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J Electromagn Anal 6 (14): 413-424
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2014,
Gao YH, Cheng K, Ge BF, Zhen P, Zhou J, Ma XN, Li SF, Chen KM
Zhongguo Gu Shang 27 (11): 933-937
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2014,
David M, Golberg R, Rubinsky B
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: S. 5329-5331; ISBN 978-1-4244-7929-0
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2014,
Mattei E, Censi F, Mancini M, Napolitano A, Genovese E, Cannata V, Burriesci G, Falsaperla R, Calcagnini G
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: S. 890-893; ISBN 978-1-4244-7929-0
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2014,
Lucke L, Bluvshtein V
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: S. 286-289; ISBN 978-1-4244-7929-0
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2014,
Keine Autoren angegeben
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: S. 6549-6552; ISBN 978-1-4244-7929-0
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2014,
Lv B, Su C, Yang L, Xie Y, Wu T
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: S. 986-989; ISBN 978-1-4244-7929-0
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2014,
Laakso I, Hirata A, Fujiwara O
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 202-205; ISBN 978-4-88552-287-1
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2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 449-452; ISBN 978-4-88552-287-1
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2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 190-193; ISBN 978-4-88552-287-1
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2014,
Sasaki K, Nagaoka T, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 537-540; ISBN 978-4-88552-287-1
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2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 186-189; ISBN 978-4-88552-287-1
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2014,
Kim M, Kim S, Ahn S, Chun Y, Park S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 426-429; ISBN 978-4-88552-287-1
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2014,
Wiart J, Conil E, Varsier N, Sarrebourse T, Hadjem A, Martens L, Wermeeren G, Corre Y
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 635-637; ISBN 978-4-88552-287-1
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2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 166-169; ISBN 978-4-88552-287-1
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2014,
Chakarothai J, Suzuki Y, Taki M, Kojima M, Sasaki K, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 182-185; ISBN 978-4-88552-287-1
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2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 237-240; ISBN 978-4-88552-287-1
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2014,
Choi DG, Kim KH, Jang JD, Chung SY, Gimm YM
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 638-641; ISBN 978-4-88552-287-1
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2014,
Kim HS, Lee YH, Choi HD, Lee AK, Lee YS, Pack JK, Kim N, Ahn YH
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 170-173; ISBN 978-4-88552-287-1
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2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 832-835; ISBN 978-4-88552-287-1
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2014,
Neufeld E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 230-233; ISBN 978-4-88552-287-1
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2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 430-433; ISBN 978-4-88552-287-1
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2014,
Kang WG, Alexander Z, Jun HY, Park YH, Pack JK
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 198-201; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 194-197; ISBN 978-4-88552-287-1
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2014,
Iwamoto T, Arima T, Uno T, Iwamoto T, Wake K, Fujii K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 529-532; ISBN 978-4-88552-287-1