Die folgenden Begriffe wurden einbezogen:
誘電の、誘電体, dielektrisch, dielectric
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2023,
Zulkefli MS, Zhang K, Sarestoniemi M, Myllymäki S, Whittow WG, Yan S, Soh PJ
IEEE J Electromagn RF Microw Med Biol 7 (3): 281-289
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2023,
Ortiz F, Díaz-Barrios A, Lopez-Cabaña ZE, González G
Polymers 15 (14): 3121
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2023,
Nouri Moqadam A, Kazemi R
Sci Rep 13: 10776
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2023,
Liporace F, Cavagnaro M
J Mech Med Biol 23 (06): 2340031
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2023,
Deepthy GS, Nesasudha M
2023 Second International Conference on Electrical, Electronics, Information and Communication Technologies (ICEEICT), Trichirappalli, India. IEEE: 1-7; ISBN 9798350397642
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2023,
Constantinescu C, Pacurar C, Giurgiuman A, Munteanu C, Andreica S, Gliga M
Appl Sci 13 (11): 6678
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2023,
Hengroemyat Y, Kaewthai T, Akkaraekthalin P, Thaiwirot W
2023 20th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON), Nakhon Phanom, Thailand. IEEE: 1-4; ISBN 9798350310474
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2023,
Tarade J, Pandit Khot U
2023 11th International Conference on Emerging Trends in Engineering & Technology - Signal and Information Processing (ICETET - SIP), Nagpur, India. IEEE: 1-7; ISBN 9798350321999
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2023,
Prakash S, Kumar K, Arulaalan M, Kalaivanan M
2023 2nd International Conference on Smart Technologies and Systems for Next Generation Computing (ICSTSN), Villupuram, India. IEEE: 1-5; ISBN 9798350348019
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2023,
Rano D, Yelizarov AA, Nazarov IV, Skuridin AA, Zakirova EA
Measurement Techniques 66 (1): 45-50
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2023,
Moharamipour S, Aminifar M, Foroughi-Gilvaee MR, Faranoush P, Mahdavi R, Abadijoo H, Parniani M, Abbasvandi F, Mansouri S, Abdolahad M
Biomater Adv 151: 213476
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2023,
Mulaparti MK, Ratnakumari UV, Satyannarayana M
Radio Sci 58 (5): 1-13
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2023,
González JF, Ramírez GA, Araque JL
2023 17th European Conference on Antennas and Propagation (EuCAP), Florence, Italy. IEEE: 1-5; ISBN 978-1-6654-7541-9
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2023,
Chellathurai AS, Sugumar D, Kishor T, Jacob LS, Aldrin AA, Shamith M
2023 4th International Conference on Signal Processing and Communication (ICSPC), Coimbatore, India. IEEE: 334-338; ISBN 9798350300789
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2023,
Sugiyama JI, Tokunaga Y, Hishida M, Tanaka M, Takeuchi K, Satoh D, Imashimizu M
Nat Commun 14: 2825
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2023,
Segawa T, Aoyama R, Tamura M
IEEE Microw Wirel Technol Lett 33 (6): 943-946
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2023,
Mohamad EA, Ramadan MA, Mostafa MM, Elneklawi MS
Electromagn Biol Med 42 (3): 99-113
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2023,
Colella M, Di Meo S, Liberti M, Pasian M, Apollonio F
IEEE Trans Microw Theory Tech 71 (10): 4533-4545
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2023,
Shimizu Y, Ishii N, Nagaoka T, Watanabe S
IEEE Trans Instrum Meas 72: 1-12
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Phys Med Biol 68 (10): 105017
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2023,
Buisson C, Mounien L, Sicard F, Landrier JF, Tishkova V, Sabouroux P
Sensors 23 (7): 3434
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2023,
Mulugeta BA, Wang S, Ben Chikha W, Liu J, Roblin C, Wiart J
Sensors 23 (7): 3583
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2023,
Cao H, Wang X, Liu J, Sun Z, Yu Z, Battino M, El-Seedi H, Guan X
Compr Rev Food Sci Food Saf 22 (3): 2465-2487
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2023,
Albornoz-Cabello M, Ibáñez-Vera AJ, Barrios-Quinta CJ, Lara-Palomo IC, Cardero-Durán MLÁ, Espejo-Antúnez L
J Clin Med 12 (6): 2348
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2023,
Gupta J, Das P, Bhowmik T, Bhattacharjee R, Sikdar D
2023 National Conference on Communications (NCC), Guwahati, India. IEEE: 1-4; ISBN 978-1-6654-5626-5
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2023,
Park CS, Tihon D, Jabbarigargari F, Abdeddaim R, Craeye C
IEEE Access 11: 24822-24834
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2023,
Kakaraparty K, Mahbub I
2023 United States National Committee of URSI National Radio Science Meeting (USNC-URSI NRSM), Boulder, CO, USA. IEEE: 141-142; ISBN 978-1-6654-7642-3
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2023,
Berezhanska M, Godinho DM, Maló P, Conceição RC
Sensors 23 (3): 1617
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2023,
Urbanowicz T, Michalak M, Marzec E, Komosa A, Filipiak KJ, Olasińska-Wiśniewska A, Witkowska A, Rodzki M, Tykarski A, Jemielity M
Int J Environ Res Public Health 20 (3): 2745
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2023,
Parker JE, Rodriguez RA
Biochim Biophys Acta (BBA) - Biomembranes 1865 (4): 184136
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2023,
Brink WM, Remis RF, Webb AG
Magn Reson Med 89 (5): 2109-2116
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2023,
Li K, Kodera S, Poljak D, Diao Y, Sasaki K, Susnjara A, Prokop A, Taguchi K, Xi J, Zhang S, Yao M, Sacco G, Zhadobov M, El Hajj W, Hirata A
IEEE Access 11: 7420-7435
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2023,
Qureshi MRA, Alfadhl Y, Chen X, Ur Rehman M
Ur Rehman M, Jamshed MA (Hrsg.): Low Electromagnetic Field Exposure Wireless Devices: Fundamentals and Recent Advances. Wiley-IEEE Press; 77-114; ISBN 978-1-119-90916-3
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2023,
Gaugain G, Quéguiner L, Bikson M, Sauleau R, Zhadobov M, Modolo J, Nikolayev D
J Neural Eng 20 (1): 016027
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2023,
Iqbal A, Al-Hasan M, Mabrouk IB, Denidni TA
IEEE Sens J 23 (3): 2105-2112
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2023,
Xi J, Christ A, Kuster N
Phys Med Biol 68 (3): 035007
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2023,
Marasco I, Niro G, De Marzo G, Rizzi F, D’Orazio A, Grande M, De Vittorio M
IEEE Electron Device Lett 44 (2): 341-344
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2023,
Qureshi MRA, Alfadhl Y, Chen X
Ur Rehman M, Jamshed MA (Hrsg.): Low Electromagnetic Field Exposure Wireless Devices: Fundamentals and Recent Advances. Wiley-IEEE Press; 49-75; ISBN 978-1-119-90916-3
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2023,
Frey JJ, Barnes RA, McClory JW
Health Phys 124 (1): 20-30
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2023,
Nagashima I, Sugiyama JI, Shimizu H
Biosci Biotechnol Biochem 87 (2): 158-162
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2023,
Marzec E, Pięta P, Olszewski J
Bioelectrochemistry 150: 108333
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2023,
Zhang HH, Gong LF, Liu XZ, Xu YX, Cheng GS, Liu Y, Shi GM, Zheng C, Han YJ
IEEE Trans Antennas Propag 71 (2): 1913-1918
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2023,
Kodera S, Miura N, Diao Y, Inoue M, Hikage T, Taguchi K, Masuda H, Hirata A
IEEE J Electromagn RF Microw Med Biol 7 (1): 65-72
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2022,
Sultan KS, Mohammed B, Manoufali M, Mahmoud A, Mills PC, Abbosh A
IEEE Trans Biomed Eng 69 (5): 1651-1662
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2022,
Li C, Sharawi MS, Mittra R
IEEE Trans Antennas Propag 70 (7): 5683-5692
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2022,
Yamazaki S, Mizuno M, Nagaoka T
2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz), Delft, Netherlands. IEEE: 1-2; ISBN 978-1-7281-9428-8
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2022,
Boparai J, Popović M
IEEE J Electromagn RF Microw Med Biol 6 (3): 296-304
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2022,
Mahmoud KR, Montaser AM
IEEE Access 10: 93338-93352
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2022,
Mittal V, Yaduvanshi RS
2022 2nd Asian Conference on Innovation in Technology (ASIANCON), Ravet, India. IEEE: 1-4; ISBN 978-1-6654-6852-7
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2022,
Gasperini D, Costa F, Daniel L, Manara G, Genovesi S
2022 Sixteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials), Siena, Italy. IEEE: X-151-X-153; ISBN 978-1-6654-6585-4