Die folgenden Begriffe wurden einbezogen:
"radio frequency", Hochfrequenz, HF, RF, 無線周波
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2023,
Esmaeili H, Yang C, Schuster C
2023 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Leuven, Belgium. IEEE: S. 1-3; ISBN 978-1-6654-9218-8
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2023,
Cerdan B, Flahaut E, Dubuc D, Grenier K
2023 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Leuven, Belgium. IEEE: S. 1-3; ISBN 978-1-6654-9218-8
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2023,
Colella M, Di Meo S, Pasian M, Liberti M, Apollonio F
2023 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Leuven, Belgium. IEEE: S. 142-144; ISBN 978-1-6654-9218-8
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2023,
Liberti M, Apollonio F, Caramazza L, Colella M, D'Agostino S, Dolciotti N, Fontana S, Paffi A, Pisano C
2023 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Leuven, Belgium. IEEE: S. 163-165; ISBN 978-1-6654-9218-8
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2023,
Laksono RM, Siswagama TA, Nery FRP, van der Weegen W, Halim W
J Pain Res 16: 3643-3653
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2023,
Kim GR, Im HH, Yoo JS, Baek DJ, Kim GH, Jin SJ, Je IJ, Kwak JH
Radiol Case Rep 18 (12): 4258-4262
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2023,
Alsing KK, Olsen O, Koch CB, Hansen RH, Persson DP, Qvortrup K, Serup J
Case Rep Dermatol 15 (1): 85-92
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2023,
Khayat S, Fanaei H, Lakzaee N
Toxicol Rep 11: 378-384
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2023,
Rahban R, Senn A, Nef S, Rӧӧsli M
Fertil Steril 120 (6): 1181-1192
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2023,
Hayat S, Ullah S, Basir A, Yoo H
IEEE Trans Antennas Propag 71 (12): 9610-9620
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2023,
Yamaguchi Y, Fukunari M, Tatematsu Y
2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Montreal, QC, Canada. IEEE: S. 1-2; ISBN 9798350336610
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2023,
Bastian GG, Pinto Nunes T, Quílez M, Fernández-Chimeno M, Silva F
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: S. 1-6; ISBN 9798350324013
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2023,
Karpowicz J, Gryz K, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: S. 1-5; ISBN 9798350324013
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2023,
Loh TH, Emrah T, Pythoud F, Fan W, Allal D, Alomainy A
2023 Antenna Measurement Techniques Association Symposium (AMTA), Renton, WA, USA. IEEE: S. 1-6; ISBN 9798350335668
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2023,
Voicu V, Dina LA, Dumbrava I, Mircea PM, Fieraru I
2023 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: S. 1-6; ISBN 9798350315257
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2023,
Herssens H, Thielens A
2023 53rd European Microwave Conference (EuMC), Berlin, Germany. IEEE: S. 444-447; ISBN 9798350347395
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2023,
Vivarelli C, Censi F, Calcagnini G, Mattei E
2023 53rd European Microwave Conference (EuMC), Berlin, Germany. IEEE: S. 263-266; ISBN 9798350347395
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2023,
Naresh Chandra Naik, Nibash Kumar Sahu, Tapas Kumar Patra
2023 1st International Conference on Circuits, Power and Intelligent Systems (CCPIS), Bhubaneswar, India. IEEE: S. 1-5; ISBN 9798350315776
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2023,
Adams JW, Chen L, Serano P, Nazarian A, Ludwig R, Makaroff SN
IEEE J Electromagn RF Microw Med Biol 7 (2): 182-186
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2023,
Han Z, Rui M, Ni C, Zhu J, Xu L, Yao M
J Clin Neurosci 118: 81-89
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2023,
Venkatachalam D, Jagadeesan V, Ismail KBM, Arun Kumar M, Mahalingam S, Kim J
Bioengineering 10 (10): 1137
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Appl Sci 13 (19): 10621
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2023,
Bidgoli HA, Schieda N, Rossa C
2023 IEEE Canadian Conference on Electrical and Computer Engineering (CCECE), Regina, SK, Canada. IEEE: S. 94-98; ISBN 9798350323986
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2023,
Ma Y, Wang N, Li K, Liang H, Bai J, Ji X
Skin Res Technol 29 (10): e13472
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GSM Association (GSMA), Mobile & Wireless Forum (MWF),
1-36
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Diritti Umani Diritto Int 17 (2): 375-404
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2023,
Hernandez D, Kim D, Nam T, Jeong Y, Seo M, Lee E, Kim J, Kim KN
IEEE Access 11: 120438-120448
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2023,
Heo DH, Park DY, Hong YH, Kim D, Kim JS
Eur Spine J 32 (8): 2769-2775
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2023,
Wagih M, Balocchi L, Benassi F, Carvalho NB, Chiao JC, Correia R, Costanzo A, Cui Y, Georgiadou D, Gouveia C, Grosinger J, Ho JS, Hu K, Komolafe A, Lemey S, Loss C, Marrocco G, Mitcheson P, Palazzi V, Panunzio N, Paolini G, Pinho P, Preishueber-Pflugl J, Qaragoez Y, Rahmani H, Rogier H, Lopera JR, Roselli L, Schreurs D, Tentzeris M, Tian X, Torah R, Torres R, Van Torre P, Vital D, Beeby S
IEEE J Microw 3 (1): 193-226
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2023 24th International Conference on Computational Problems of Electrical Engineering (CPEE), Grybów, Poland. IEEE: S. 1-4; ISBN 9798350330359
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2023,
Baginska U, Moro A, Toonen RF, Verhage M
J Neurosci 43 (45): 7616-7625
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2023,
Gombarska D, Smetana M, Psenakova Z, Boleckova S
2023 24th International Conference on Computational Problems of Electrical Engineering (CPEE), Grybów, Poland. IEEE: S. 1-4; ISBN 9798350330359
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2023,
Bodin R, Seewooruttun C, Corona A, Delanaud S, Pelletier A, Villégier AS
Environ Sci Pollut Res 30 (53): 113704-113717
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2023,
Tamura M, Kawamoto T, Ishifuro M, Tamura T, Masumoto Y, Kenjo M, Kiguchi M, Awai K, Nagata Y
J Med Syst 47 (1): 107
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2023,
Chen YH, Liang SC, Sun CK, Cheng YS, Tzang RF, Chiu HJ, Wang MY, Cheng YC, Hung KC
BMC Psychiatry 23: 756
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2023,
Gross D, Scandling B, Leewood AR, Simonetti OP
Biomed Phys Eng Express 9 (6): 065025
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2023,
Sharbafshaaer M, Gigi I, Lavorgna L, Esposito S, Bonavita S, Tedeschi G, Esposito F, Trojsi F
J Clin Med 12 (19): 6190
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2023,
Li K, Hikage T, Masuda H, Ijima E, Nagai A, Taguchi K
Sci Rep 13: 17397
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2023,
Akbari H, Taghavi L, Hossaini SKE, Gholami-Fesharaki M, Mirzahosseini SAH
Trauma Mon 28 (4): 876-881
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2023,
Guo M, Wang T, Zhang T, Zhai H, Xu G
Med Biol Eng Comput 61 (12): 3209-3223
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2023,
Yang L, Wang B, Li Y
Front Inform Technol Elect Eng 24 (9): 1357-1365
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2023,
Sharma S, Sharma P, Bahel S, Singh J, Katnoria JK
Toxicol Environ Health Sci 15 (4): 385-398
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2023,
Chen B, Dammann P, Jabbarli R, Sure U, Quick HH, Kraff O, Wrede KH
PLoS One 18 (10): e0292666
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2023,
Baňas M, Šofranková L, Kurimský J, Pavlík M, Pikalík M, Majláthová V, Cimbala R, Pipová N, Wurfl L, Majláth I
Exp Appl Acarol 91 (3): 477-485
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2023,
Yamaguchi-Sekino S, Ikuyo M, Kamegai K, Taki M, Onishi T, Watanabe S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: S. 1-6; ISBN 9798350324013
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: S. 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: S. 1-6; ISBN 9798350324013
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2023,
Cvetković M, Poljak D, Dodig H
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: S. 1-6; ISBN 9798350301076
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2023,
Kapetanović A, Poljak D, Dodig H
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: S. 1-5; ISBN 9798350301076
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Facial Plast Surg Clin North Am 31 (4): 495-502