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2020,
Stockly OR, Wolfe AE, Espinoza LF, Simko LC, Kowalske K, Carrougher GJ, Gibran N, Bamer AM, Meyer W, Rosenberg M, Rosenberg L, Kazis LE, Ryan CM, Schneider JC
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2020,
Tan ET, Hua Y, Fiveland EW, Vermilyea ME, Piel JE, Park KJ, Ho VB, Foo TKF
Magn Reson Med 83 (1): 352-366
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2020,
Rumpf JJ, May L, Fricke C, Classen J, Hartwigsen G
Cereb Cortex 30 (3): 1030-1039
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2020,
Szelenberger R, Kostka J, Saluk-Bijak J, Miller E
Curr Neuropharmacol 18 (1): 51-64
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2020,
Hadar R, Winter R, Edemann-Callesen H, Wieske F, Habelt B, Khadka N, Felgel-Farnholz V, Barroeta-Hlusicka E, Reis J, Tatarau CA, Funke K, Fritsch B, Bernhardt N, Bikson M, Nitsche MA, Winter C
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2020,
Jones ML, Morris JT, Mueller JL, Lippincott B, Sweatman WM
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IEEE Trans Compon Packaging Manuf Technol 9 (7): 1253-1263
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2019,
Bardati F, Di Carlofelice A, Tognolatti P
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: S. 2538-2546; ISBN 978-1-7281-3404-8
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2019,
Rahman AA, Kamardin K, Yamada Y
2019 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE), Melacca, Malaysia. IEEE: S. 1-5; ISBN 978-1-7281-2163-5
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2019,
Alshehri J, Alshalawi A, Khalid M
2019 8th International Conference on Renewable Energy Research and Applications (ICRERA), Brasov, Romania. IEEE, Rumänien: S. 377-380; ISBN 978-1-7281-3588-5
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2019 European Microwave Conference in Central Europe (EuMCE), Prague, Czech Republic. IEEE: S. 403-408; ISBN 978-1-7281-1240-4
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2019,
Nan H, Liu S, Buckmaster JG, Arbabian A
IEEE Trans Microw Theory Tech 67 (1): 464-474
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2019,
Le DT, Li K, Watanabe S, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 78-81; ISBN 978-1-7281-1639-6
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2019,
Avdievich NI, Solomakha G, Ruhm L, Scheffler K, Henning A
Magn Reson Med 82 (2): 811-824
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2019,
Sahmelikoglu AG, Karakas S, Tellioglu AM, Acer N, Bilgen M
Erciyes Medical Journal 41 (4): 444-449
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2019,
Yudhistiara B, Weber KJ, Huber PE, Ruehle A, Brons S, Haering P, Debus J, Hauswald H
Cancer Manag Res 11: 8327-8335
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2019,
Ravier D, Morelli I, Curci D, Messina C, Verdoni F, Accetta R, Peretti GM
J Biol Regul Homeost Agents 33 (6) Suppl 3: 203-205
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2019,
Winkle RA, Mohanty S, Patrawala RA, Mead RH, Kong MH, Engel G, Salcedo J, Trivedi CG, Gianni C, Jais P, Natale A, Day JD
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2019,
Chen GX, 't Mannetje AM, Douwes J, van den Berg L, Pearce N, Kromhout H, D'Souza W, McConnell M, Glass B, Brewer N, McLean DJ
Occup Environ Med 76 (5): 309-316
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2019,
Alkis ME, Akdag MZ, Dasdag S, Yegin K, Akpolat V
Biotechnol Biotechnol Equip 33 (1): 1733-1740
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2019,
Wang K, Parekh U, Ting JK, Yamamoto NAD, Zhu J, Costantini T, Arias AC, Eliceiri BP, Ng TN
Adv Biosyst 3 (10): e1900106
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2019,
Baskaran D, Arunachalam K
2019 IEEE MTT-S International Microwave and RF Conference (IMARC), Mumbai, India. IEEE: S. 1-4; ISBN 978-1-7281-4041-4
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2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: S. 5192-5195; ISBN 978-1-5386-1312-2
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J Neural Eng 16 (3): 036002
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2019,
van Gorp EJAA, Teernstra O, Aukes HJ, Hamm-Faber T, Bürger K, Kallewaard JW, Spincemaille G, Schapendonk JWLC, Vonhögen L, Bronkhorst E, Vissers KCP
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2019,
Minucci S, Calabrò G, Astolfi S, Campiglia E
2019 19th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering (ISEF), Nancy, France. IEEE: S. 1-2; ISBN 978-1-7281-1561-0
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2019,
Misselhorn J, Schwab BC, Schneider TR, Engel AK
eNeuro 6 (5): ENEURO.0101-19.2019
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2019,
Cury RG, França C, Barbosa ER, Galhardoni R, Lepski G, Teixeira MJ, Ciampi de Andrade D
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2019,
Mescia L, Chiapperino MA, Bia P, Lamacchia CM, Gielis J, Caratelli D
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: S. 2992-2998; ISBN 978-1-7281-3404-8
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2019 International Conference on Advances in Computing and Communication Engineering (ICACCE), Sathyamangalam, Tamil Nadu, India. IEEE: S. 1-6; ISBN 978-1-7281-3251-8
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2019,
Hu C, Fan X, He L, Li X, Tong L
2019 IEEE 3rd International Electrical and Energy Conference (CIEEC), Beijing, China. IEEE: S. 1727-1731; ISBN 978-1-7281-1676-1
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2019 IEEE 3rd International Electrical and Energy Conference (CIEEC), Beijing, China. IEEE: S. 1507-1512; ISBN 978-1-7281-1676-1
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2019,
Shepherd RK, Carter PM, Enke YL, Wise AK, Fallon JB
J Neural Eng 16 (2): 026009
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2019,
Djuric N, Kavecan N, Kljajic D, Mijatovic G, Djuric S
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: S. 2226-2234; ISBN 978-1-7281-3404-8
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2019,
Wang C, Hu X, Zhang Z
J Aerosol Sci 137: 105437
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2019,
Rahman A, Hossain F
2019 International Conference on Computer, Communication, Chemical, Materials and Electronic Engineering (IC4ME2), Rajshahi, Bangladesh. IEEE: S. 1-6; ISBN 978-1-7281-3061-3
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2019,
Panov E, Yordanova M, Mehmed-Hamza M
2019 11th Electrical Engineering Faculty Conference (BulEF), Varna, Bulgaria. IEEE: S. 1-4; ISBN 978-1-7281-2698-2
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2019,
Meliadò EF, van den Berg CAT, Luijten PR, Raaijmakers AJE
Magn Reson Med 81 (3): 2106-2119
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International Electrotechnical Commission (IEC),
IEC 60479-2:2019: 1-56, ISBN 978-2-8-3226689-2
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2019,
Gökçek-Saraç Ç, Özen Ş, Derin N
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: S. 1439-1444; ISBN 978-1-7281-3404-8
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2019,
Zimin KA, Rubtsova NB, Ryabchenko VN, Tokarskiy AY
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: S. 1171-1179; ISBN 978-1-7281-3404-8
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2019,
Rodríguez-de la Fuente AO, Gomez-Flores R, Heredia-Rojas JA, García-Muñoz EM, Vargasvillarreal J, Hernández-García ME, Gonzálezsalazar F, Garza-González JN, Beltcheva M, Heredia-Rodríguez O
Iran J Parasitol 14 (4): 652-656
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2019,
Lorenz R, Simmons LE, Monti RP, Arthur JL, Limal S, Laakso I, Leech R, Violante IR
Brain Stimul 12 (6): 1484-1489
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2019,
Narang P, Madigan K, Sarai S, Lippmann S
Innov Clin Neurosci 16 (9-10): 33-35
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2019,
Shimizu Y, Ishii N, Nagaoka T, Wake K, Watanabe S
2019 IEEE Conference on Antenna Measurements & Applications (CAMA), Kuta, Bali, Indonesia. IEEE: S. 115-117; ISBN 978-1-7281-2397-4
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2019,
Li H, Li L, Zhang K, Liu Y, Wang Y, Shen Y, Xiong C
2019 IEEE 3rd Advanced Information Management, Communicates, Electronic and Automation Control Conference (IMCEC), Chongqing, China. IEEE: S. 1977-1980; ISBN 978-1-7281-0514-7
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J Clin Aesthet Dermatol 12 (12): E58-E63
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2019,
Ren X, Liu W, Su Z, Wu H, Qiao S, Lu H, Shen G
2019 12th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), Suzhou, China. IEEE: S. 1-5; ISBN 978-1-7281-4853-3
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2019,
Buyakova NV, Txao LV, Kryukov AV
2019 International Multi-Conference on Industrial Engineering and Modern Technologies (FarEastCon), Vladivostok, Russia. IEEE: S. 1-5; ISBN 978-1-7281-0062-3
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2019,
Qiu S, Wang S, Yi W, Zhang C, He H
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: S. 5918-5922; ISBN 978-1-5386-1312-2