キーワード:
Leistungsdichte, Leistungsflussdichte, "power flux density", "power density", 電力束密度, 電力密度
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2022,
Chountala C, Chareau JM, Baldini G, Bonavitacola F
2022 9th International Conference on Wireless Networks and Mobile Communications (WINCOM), Rabat, Morocco. IEEE: pp. 1-6; ISBN 978-1-6654-5277-9
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2022,
Wydaeghe R, Shikhantsov S, Tanghe E, Vermeeren G, Martens L, Demeester P, Joseph W
IEEE Access 10: 130996-131004
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2022,
Salem MA, Lim HS, Chua MY, Chien SF, Zarakovitis CC, Ng CY, Abd Rahman NZ
Int J Technol 13 (6): 1298-1307
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2022,
Fontá Romero C, Auñón Marugán A, Rodríguez Varela F, Bielza López P, Alcolea Coronel JL, Alonso Montes JI, Sierra Castañer M
2022 Antenna Measurement Techniques Association Symposium (AMTA), Denver, CO, USA. IEEE: pp. 1-5; ISBN 978-1-6654-8427-5
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2022,
Tayebi-khorami M, Chegeni N, Tahmasbi Birgani M, Danyaei A, Fardid R, Zafari J
Pharm Sci 28 (2): 295-303
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2022,
Baliah J, Subramanian B, Livingstone D, Kanwal B, Zaman MU, Srivastava KC, Abutayyem H, Al-Johani K, David AP, Shrivastava D, Alam MK
Int J Environ Res Public Health 19 (21): 14157
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2022,
López I, Rivera M, Félix N, Maestú C
Front Public Health 10: 992645
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2022,
Kapetanović AL, Šušnjara A, Poljak D, Russo M
2022 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: pp. 1-5; ISBN 978-1-6654-7018-6
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2022,
Colombi D, Ghasemifard F, Joshi P, Xu B, Di Paola C, Törnevik C
IEEE Trans Electromagn Compat 64 (6): 1986-1993
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2022,
Morimoto R, Hirata A
Phys Med Biol 67 (21): 215014
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 525-530; ISBN 978-1-6654-0789-2
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2022,
Barbosa Filho JML, Campos MMdM, Flor DL, Alves WS, D’Assunção AG, Rodrigues MEC, de Sousa VAJr
Sensors 22 (18): 7017
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2022,
Islam S, Zada M, Yoo H
IEEE Trans Antennas Propag 70 (12): 11629-11638
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2022,
Gupta V, Srivastava R
Biochem Biophys Res Commun 629: 61-70
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2022,
Taguchi K, Kodera S, Hirata A, Kashiwa T
IEEE J Electromagn RF Microw Med Biol 6 (4): 516-523
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2022 IEEE XXIX International Conference on Electronics, Electrical Engineering and Computing (INTERCON), Lima, Peru. IEEE: pp. 1-4; ISBN 978-1-6654-8637-8
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2022,
Duris V, Ivanov VN, Chumarov SG
TEM J 11 (2): 920-925
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2022,
Mumtaz S, Rana JN, Choi EH, Han I
Int J Mol Sci 23 (16): 9288
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2022,
Poljak D, Šušnjara A, Kraljević L
2022 7th International Conference on Smart and Sustainable Technologies (SpliTech), Split / Bol, Croatia. IEEE: pp. 1-4; ISBN 978-1-6654-8828-0
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2022,
De Santis V, Di Francesco A, Bit-Babik G, Roman J, El Hajj W
IEEE Access 10: 82236-82245
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2022,
López-Orenes A, Ferrer MA, Calderón AA
J Nat Prod 85 (8): 2104-2109
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2022,
Bonato M, Dossi L, Fiocchi S, Gallucci S, Benini M, Chiaramello E, Tognola G, Parazzini M
2022 Microwave Mediterranean Symposium (MMS), Pizzo Calabro, Italy. IEEE: pp. 1-4; ISBN 978-1-6654-7111-4
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2022,
Zhao L, Yao C, Wang H, Dong J, Zhang J, Xu X, Wang H, Yao B, Ren K, Sun L, Peng R
Int J Mol Sci 23 (13): 6949
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2022,
Zhu W, Xu X, Wu T, Li C
2022 3rd URSI Atlantic and Asia Pacific Radio Science Meeting (AT-AP-RASC), Gran Canaria, Spain. IEEE: pp. 1-3; ISBN 978-1-6654-9986-6
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2022,
Kapetanović AL, Poljak D
IEEE Trans Electromagn Compat 64 (5): 1296-1303