Die folgenden Begriffe wurden einbezogen:
thermic, thermisch, thermal, 熱の
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2023,
Bottauscio O, Arduino A, Chiampi M, Zilberti L
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2023,
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Int J Hyperthermia 40 (1): 2152500
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2023,
Chiao JC, Li C, Lin J, Caverly RH, Hwang JCM, Rosen H, Rosen A
IEEE J Microw 3 (1): 134-169
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2023,
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Int J Radiat Biol 99 (8): 1167-1177
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2023,
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2023,
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2023,
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Food Bioproc Tech 16 (2): 313–326
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2023,
Kodera S, Miura N, Diao Y, Inoue M, Hikage T, Taguchi K, Masuda H, Hirata A
IEEE J Electromagn RF Microw Med Biol 7 (1): 65-72
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2023,
Li P, Xu J, Shi Q, Wang J, Zhang W, Zheng L, Wang M, Fan Y
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2023,
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2023,
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2023,
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IEEE J Microw 3 (1): 170-180
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2023,
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IEEE Trans Biomed Eng 70 (2): 640-649
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2023,
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Rev Environ Health 38 (3): 531-546
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2023,
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Int J Microw Wirel Technol 15 (2): 213-226
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Magn Reson Med Sci 22 (1): 7-25
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2022,
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2022,
Xiao Y, Zhao L, Peng R
Virol J 19: 161
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2022,
Abbas IA, Youssef HM, El-Bary AA
Mathematics 10 (18): 3296
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2022,
Karim ML, Bosnjak A, McLaughlin J, Crawford P, McEneaney D, Escalona OJ
2022 Computing in Cardiology (CinC), Tampere, Finland. Band 498; IEEE: S. 1-4; ISBN 9798350310139
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2022,
Ara A, Sheikh JA, Khan UR, Ali B, Javeed S
2022 5th International Conference on Multimedia, Signal Processing and Communication Technologies (IMPACT), Aligarh, India. IEEE: S. 1-6; ISBN 978-1-6654-7648-5
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2022,
Mahmoud KR, Montaser AM
IEEE Access 10: 93338-93352
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2022,
Wane S, Dinh TV, Tran QH, Bajon D, Ferrero F, Duvillaret L, Gaborit G, Sombrin J, de Lédinghen E, Laban P, Huard V, Mhira S, Tombakdjian L, Ratajczak P, Bousseksou A
2022 IEEE Radio and Wireless Symposium (RWS), Las Vegas, NV, USA. IEEE: S. 68-71; ISBN 978-1-6654-3463-8
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2022,
Caramazza L, Paffi A, Liberti M, Apollonio F
2021 51st European Microwave Conference (EuMC), London, United Kingdom. IEEE: S. 785-788; ISBN 978-1-6654-4721-8
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2022,
Portosi V, Loconsole AM, Valori M, Marrocco V, Bonelli F, Pascazio G, Lampignano V, Fasano A, Prudenzano F
2022 Microwave Mediterranean Symposium (MMS), Pizzo Calabro, Italy. IEEE: S. 315-319; ISBN 978-1-6654-7111-4
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2022,
Kim J, Seo C, Seo JM
2022 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Glasgow, Scotland, United Kingdom. IEEE: S. 4261-4264; ISBN 978-1-7281-2783-5
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2022 IEEE International RF and Microwave Conference (RFM), Kuala Lumpur, Malaysia. IEEE: S. 1-4; ISBN 978-1-6654-8978-2
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2022,
Romanenko S, Siegel PH, Wallace VP
2022 IEEE 2nd Ukrainian Microwave Week (UkrMW), Ukraine. IEEE: S. 529-534; ISBN 9798350331530
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2022,
Shabeeb Ahamed KP, Arunachalam K
2022 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON), Bangalore, India. IEEE: S. 449-453; ISBN 978-1-6654-5204-5
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2022,
Jeladze V, Shoshiashvili L, Partsvania B
2022 IEEE 2nd Ukrainian Microwave Week (UkrMW), Ukraine. IEEE: S. 477-481; ISBN 9798350331530
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2022,
Matveev I, Zhorina L, Shishkin Y
2022 IEEE International Multi-Conference on Engineering, Computer and Information Sciences (SIBIRCON), Yekaterinburg, Russian Federation. IEEE: S. 440-445; ISBN 978-1-6654-6481-9
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2022,
Aeen MP, Mahdavi SM, Maghami P, Modarresi Chahardehi A
Act Nerv Super Rediviva 64 (2-3): 77-85
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UMID 2: 5-14
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2022,
Yamamoto K, Hikage T, Masuda H, Ishitake T, Li K, Nagai A
2022 International Symposium on Antennas and Propagation (ISAP), Sydney, Australia. IEEE: S. 277-278; ISBN 978-1-6654-7963-9
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2022,
Yamamoto K, Hikage T, Masuda H, Ishitake T, Li K, Nagai A
2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Narashino, Japan. IEEE: S. 37-38; ISBN 978-1-6654-3239-9
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2022,
Cappucci U, Casale AM, Proietti M, Marinelli F, Giuliani L, Piacentini L
Cells 11 (24): 4036
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2022,
González-Suárez A, Pérez JJ, O'Brien B, Elahi A
J Cardiovasc Dev Dis 9 (12): 458
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2022,
Yao C, Wang H, Sun L, Ren K, Dong J, Wang H, Zhang J, Xu X, Yao B, Zhou H, Zhao L, Peng R
Cells 11 (23): 3849
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2022,
Bannikova S, Khlebodarova T, Vasilieva A, Mescheryakova I, Bryanskaya A, Shedko E, Popik V, Goryachkovskaya T, Peltek S
Int J Mol Sci 23 (23): 15216
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2022,
Vu J, Bhusal B, Nguyen BT, Sanpitak P, Nowac E, Pilitsis J, Rosenow J, Golestanirad L
PLoS One 17 (12): e0278187
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2022,
Kim HS, Kim Y, Jeon SB, Choi HD, Lee AK, Lee HJ, Pack JK, Kim N, Ahn YH
J Therm Biol 110: 103350
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2022,
Grüning G, Wong SY, Gerhards L, Schuhmann F, Kattnig DR, Hore PJ, Solov'yov IA
J Am Chem Soc 144 (50): 22902-22914
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2022,
Vilela FB, Silva ES, de Lourdes Noronha Motta Melo M, Oliveira RMP, Capellato P, Sachs D
Materials 15 (22): 8141
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2022,
Liu K, Wang Z, Liu Y, Zhu P, Zhang S, Lu S, Hu W, Xu B, Zhang S, Gong Y
J Vis Exp (189)
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2022,
Garvanova M, Garvanov I, Borissova D
Shishkov B (Hrsg.): Business Modeling and Software Design, BMSD 2022. Lecture Notes in Business Information Processing, Band 453; Springer, Cham; S. 299-307; ISBN 978-3-031-11509-7
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2022,
Zablodskiy M, Pliuhin V, Kucheruk P
2022 IEEE 41st International Conference on Electronics and Nanotechnology (ELNANO), Kyiv, Ukraine. IEEE: S. 391-396; ISBN 978-1-6654-6923-4
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2022,
Wold A, Rådman L, Norman K, Olausson H, Thordstein M
Brain Sci 12 (10): 1301
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2022,
López I, Rivera M, Félix N, Maestú C
Front Public Health 10: 992645
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2022,
Karim ML, Bosnjak AM, McLaughlin J, Crawford P, McEneaney D, Escalona OJ
Sensors 22 (20): 7775
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2022,
Ji F, Sun J, Sui Y, Qi X, Mao X
Curr Res Food Sci 5: 1906-1915