Die folgenden Begriffe wurden einbezogen:
t-検定, t-Test, "Student's t-test", スチューデントt-検定
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2023,
Peng C, Dan L, Jia-Hui Z
2023 IEEE 11th International Conference on Information, Communication and Networks (ICICN), Xi'an, China. IEEE: S. 524-527; ISBN 9798350314021
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2023,
Senwen L, Zhizhong W, Yan R, Huagang W, Shaochuan C
2023 IEEE 11th International Conference on Information, Communication and Networks (ICICN), Xi'an, China. IEEE: S. 432-440; ISBN 9798350314021
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2023,
Nwogbaga I, Kim AH, Camley BA
Phys Rev E 108 (6): 064411
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2023,
Che LQ, Qu ZZ, Xie T, Zhang YG, Yuan DJ, Li Q, Jia LJ, Wang WP
Acta Neurobiol Exp 83 (4): 395-403
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2023,
Gutiérrez-Martínez J, Toledo-Peral CL, Vega-Martínez G, Mercado-Gutiérrez JA
2023 Global Medical Engineering Physics Exchanges/Pacific Health Care Engineering (GMEPE/PAHCE), Songdo, Korea, Republic of. IEEE: S. 1-6; ISBN 9798350304015
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2023,
Cresci A, Durif CMF, Larsen T, Bjelland R, Skiftesvik AB, Browman HI
ICES J Mar Sci: fsad205 [im Druck]
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2023,
Vélez RS, van Helvoort MJAM, Vogt-Ardatjew R, Van den Berg B, Leferink F
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: S. 1-6; ISBN 9798350324013
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2023,
Bhatia N, Dinesh S, Nagesh S
J Clin of Diagn Res 17 (10): ZC28-ZC32
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2023,
Zhou X, Dou L, Huang H, Shen Q, Zhou X, Li A, Tang W, Pang X, Zhang Y, Wu T
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: S. 1-5; ISBN 9798350333114
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2023,
Xinhua P, Xin Z, Huixiong H, Qingfei S, Anxiang L, Wei T, Chao Y, Tong W
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: S. 1-5; ISBN 9798350333114