-
2020,
Rumpf JJ, May L, Fricke C, Classen J, Hartwigsen G
Cereb Cortex 30 (3): 1030-1039
-
2020,
Hofstoetter US, Freundl B, Danner SM, Krenn MJ, Mayr W, Binder H, Minassian K
J Neurotrauma 37 (3): 481-493
-
2020,
Sinha P, Sarkar B, Goswami S, Ray Karmakar P, Dasgupta SR, Basu S
Pain Pract 20 (1): 16-23
-
2020,
Zheng J, Lan Q, Zhang X, Kainz W, Chen J
IEEE Trans Electromagn Compat 62 (3): 673-681
-
2020,
Medaglia JD, Erickson B, Zimmerman J, Kelkar A
Int J Psychophysiol 154: 101-110
-
IEEE Trans Compon Packaging Manuf Technol 9 (7): 1253-1263
-
2019,
Ortego-Isasa I, Martins A, Birbaumer N, Ramos-Murguialday A
2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), San Francisco, CA, USA. IEEE: S. 381-384; ISBN 978-1-5386-7922-7
-
2019,
Mahmood Alabed EA, Engel M, Yamauchi Y, Hossain MSA, Ooi L
RSC Adv 9 (31): 17717-17725
-
eLife 8: e45807
-
2019,
Laiwalla F, Lee J, Lee AH, Mok E, Leung V, Shellhammer S, Song YK, Larson L, Nurmikko A
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: S. 6876-6879; ISBN 978-1-5386-1312-2
-
2019,
Crosson B, Rodriguez AD, Copland D, Fridriksson J, Krishnamurthy LC, Meinzer M, Raymer AM, Krishnamurthy V, Leff AP
J Neurol Neurosurg Psychiatry 90 (10): 1147-1155
-
2019,
Fassnidge C, Ball D, Kazaz Z, Knudsen S, Spicer A, Tipple A, Freeman E
J Cogn Neurosci 31 (6): 922-935
-
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: S. 5192-5195; ISBN 978-1-5386-1312-2
-
2019,
Tanaka Y, Nomoto T, Shiki T, Sakata Y, Shimada Y, Hayashida Y, Yagi T
J Neural Eng 16 (3): 036007
-
J Neural Eng 16 (3): 036002
-
2019,
Abend R, Sar-El R, Gonen T, Jalon I, Vaisvaser S, Bar-Haim Y, Hendler T
Neuromodulation 22 (8): 884-893
-
2019,
Lebois LAM, Seligowski AV, Wolff JD, Hill SB, Ressler KJ
Annu Rev Clin Psychol 15: 257-284
-
2019,
Vrabec TL, Eggers TE, Foldes EL, Ackermann DM, Kilgore KL, Bhadra N
J Neuroeng Rehabil 16: 80
-
2019,
Zhou H, Ma Y, Lou Y, Xiao L
2019 International Conference on Medical Imaging Physics and Engineering (ICMIPE), Shenzhen, China. IEEE: S. 1-4; ISBN 978-1-7281-4856-4
-
2019,
Otsuru N, Kamijo K, Otsuki T, Kojima S, Miyaguchi S, Saito K, Inukai Y, Onishi H
Behav Brain Res 368: 111899
-
2019,
Shepherd RK, Carter PM, Enke YL, Wise AK, Fallon JB
J Neural Eng 16 (2): 026009
-
2019,
Sun P, Li Q, Li H, Di L, Su X, Chen J, Zheng H, Chen Y, Zhou C, Chai X
IEEE Trans Neural Syst Rehabil Eng 27 (5): 905-915
-
2019,
Li YT, Chen SC, Yang LY, Hsieh TH, Peng CW
IEEE Trans Neural Syst Rehabil Eng 27 (5): 805-813
-
2019,
Sreeraj VS, Shivakumar V, Sowmya S, Bose A, Nawani H, Narayanaswamy JC, Venkatasubramanian G
J ECT 35 (2): 139-143
-
2019,
Van Lysebettens W, Vonck K, Larsen LE, Sprengers M, Carrette E, Bouckaert C, Delbeke J, Jan Wadman W, Boon P, Raedt R
Int J Neural Syst 29 (9): 1950008