-
International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE),
IEC/IEEE 62704-1:2017: 1-86, ISBN 978-1-5044-4259-6
-
2017,
Mohammed B, Jin J, Abbosh A, Bialkowski K, Manoufali M, Crozier S
IEEE Access 5: 27345 - 27353
-
2017,
Kazemein Jasemi VS, Samadi F, Eimani H, Hasani S, Fathi R, Shahverdi A, Shahi Sadrabadi F
Vet Res Forum 8 (3): 243-249
-
2017,
Razmjoo J, Alinian S
Electromagn Biol Med 36 (4): 325-329
-
2017,
Chen G, Zhao L, Yu W, Jin JM
2017 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, San Diego, CA, USA. IEEE; ISBN 978-1-5386-0898-2
-
2017,
Yang R, Zheng J, Chen J, Kainz W
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
-
2017 40th International Conference on Telecommunications and Signal Processing (TSP), Barcelona. IEEE; ISBN 978-1-5090-3983-8
-
2017,
Oganezova I, Pommerenke D, Zhou J, Ghosh K, Hosseinbeig A, Lee J, Tsitskishvili N
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
-
2017,
Hough CM, Purschke DN, Huang C, Titova LV, Kovalchuk O, Warkentin BJ, Hegmann FA
2017 42nd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Cancun, Mexico. IEEE, Cancun, Mexico; ISBN 978-1-5090-6050-4
-
IEEE Trans Nanobioscience 16 (8): 802 - 809