Die folgenden Begriffe wurden einbezogen:
EMF, "Elektromagnetisches Feld", "electromagnetic field", 電磁界
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2023,
Liu Q, Zhao H, Zhang H, Yuan Y
2023 5th International Conference on Intelligent Control, Measurement and Signal Processing (ICMSP), Chengdu, China. IEEE: S. 241-245; ISBN 9798350336047
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2023,
Gutiérrez-Martínez J, Toledo-Peral CL, Vega-Martínez G, Mercado-Gutiérrez JA
2023 Global Medical Engineering Physics Exchanges/Pacific Health Care Engineering (GMEPE/PAHCE), Songdo, Korea, Republic of. IEEE: S. 1-6; ISBN 9798350304015
-
2023,
Zhao X, Zhang L, Zhang X, Dou S, Yang J, Zheng S
IEEE Trans Instrum Meas 72: 1-10
-
2023,
Wakkary R, Oogjes D, Sakib N, Behzad A
Byrne D, Martelaro N, Boucher A, Chatting D, Fdili Alaoui S, Fox S, Nicenboim I, MacArthur C (Hrsg.): DIS '23: Proceedings of the 2023 ACM Designing Interactive Systems Conference. Association for Computing Machinery (ACM), New York, NY, USA; S. 790-807; ISBN 978-1-4503-9893-0
-
2023,
Budak M, Kiliç MA, Kalkan T, Tuncel H
Indian J Exp Biol 61 (12): 941-945
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2023,
Soares NE, Bulla G, Fernandez-Rodriguez CE, De Salles ÁAA
2023 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC), Castelldefels, Spain. IEEE: S. 28-30; ISBN 9798350320688
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2023,
Huseynov AN, Malanchuk VA, Myroshnychenko MS, Markovska OV, Sukharieva LP, Kuznetsova MO
Pol Merkur Lek 51 (6): 592-597
-
2023,
Sagar A, Kashyap A, Nasab MA, Padmanaban S, Bertoluzzo M, Kumar A, Blaabjerg F
IEEE Access 11: 83703-83751
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2023 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD), Tianjin, China. IEEE: S. 1-2; ISBN 9798350301588
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2023,
Bajtos M, Radil R, Janoušek L, Bajtos M, Dang N
2023 24th International Conference on Computational Problems of Electrical Engineering (CPEE), Grybów, Poland. IEEE: S. 1-4; ISBN 9798350330359
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2023,
Tuta L, Panait-Radu F, Ardelean F, Gorgoteanu D, Rosu G
Electronics 12 (24): 5003
-
2023,
Czerwonky DM, Aberra AS, Gomez LJ
bioRxiv: the Preprint Server for Biology (bioRxiv),
2023.12.15.571917
-
2023,
Soares NE, Bulla G, Fernandez-Rodriguez CE, De Salles AAA
2023 IEEE MTT-S Latin America Microwave Conference (LAMC), San José, Costa Rica. IEEE: S. 58-60; ISBN 9798350316414
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2023,
Wang L, Li S, Li T, Zheng W, Li Y, Xu G
Sheng Wu Yi Xue Gong Cheng Xue Za Zhi 40 (6): 1135-1141
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2023,
Nowak-Terpiłowska A, Górski R, Marszałek M, Wosiński S, Przesmycki R, Bugaj M, Nowosielski L, Baranowski M, Zeyland J
Ann Agric Environ Med 30 (4): 763-772
-
2023,
Šarolić A, Perić M, Kulić D, Sapunar D
2023 24th International Conference on Applied Electromagnetics and Communications (ICECOM), Dubrovnik, Croatia. IEEE: S. 1-4; ISBN 9798350313024
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2023 24th International Conference on Applied Electromagnetics and Communications (ICECOM), Dubrovnik, Croatia. IEEE: S. 1-6; ISBN 9798350313024
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2023,
Font YS, Díaz YO, Cuypers A, Aleman EI, Vandamme D
J Appl Phycol 35 (4): 1525–1536
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2023,
Lestini F, Marrocco G, Occhiuzzi C
2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa, Italy. IEEE: S. 445-448; ISBN 9798350323054
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2023,
Xie Y, Pan J, Chen J, Zhang D, Jin S
NeuroRehabilitation 53 (4): 423-438
-
2023,
Goudarzi M, Fatahi Asl J, Shoghi H
J Teh Univ Heart Ctr 18 (3): 207-213
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2023,
Casal D, Casimiro MH, Ferreira LM, Leal JP, Rodrigues G, Lopes R, Moura DL, Gonçalves L, Lago JB, Pais D, Santos PMP
Biomedicines 11 (12): 3195
-
2023,
Ranjbar N, Bakhshandeh B, Pennisi CP
Bioengineering 10 (12): 1438
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2023,
McGraw M, Gilmer G, Bergmann J, Seshan V, Wang K, Pekker D, Modo M, Ambrosio F
J Tissue Eng Regen Med 2023: 5038317
-
2023,
Sarimov RM, Serov DA, Gudkov SV
Biology 12 (12): 1506