Die folgenden Begriffe wurden einbezogen:
Implantat, implant, インプラント
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2023,
Rehman M, Mirsaeidi S, Nor NM, Koondhar MA, Zainuri MAAM, Alaas ZM, Tag-Eldin E, Ghamry NA, Ahmed MMR
IEEE Access 11: 144978-145010
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2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: S. 1-4; ISBN 9798350333114
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2023,
Clausen-Oreamuno C, Perez-Rodrigo S, Stillaert FBJL, Tejerina A, Tejerina A, Shellock FG
Aesthet Surg J 44 (1): 50-59
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2023,
Noetscher GM, Serano PJ, Horner M, Prokop A, Hanson J, Fujimoto K, Brown J, Nazarian A, Ackerman J, Makaroff SN
eLife 12: RP90440
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2023,
Zaidi T, Bonmassar G, Golestanirad L
2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Sydney, Australia. IEEE: S. 1-4; ISBN 9798350324488
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2023,
Zinno C, Agnesi F, Bernini F, Gabisonia K, Terlizzi D, Recchia FA, Lionetti V, Micera S
2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Sydney, Australia. IEEE: S. 1-4; ISBN 9798350324488
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2023,
Vu J, Sanpitak P, Bhusal B, Jiang F, Golestanirad L
2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Sydney, Australia. IEEE: S. 1-4; ISBN 9798350324488
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2023,
Sanpitak P, Bhusal B, Vu J, Golestanirad L
2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Sydney, Australia. IEEE: S. 1-5; ISBN 9798350324488
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2023,
Vu J, Bhusal B, Rosenow J, Pilitsis J, Golestanirad L
2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Sydney, Australia. IEEE: S. 1-5; ISBN 9798350324488
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2023,
Tian R, Wu YQ, Lu M, Miao XF
Electronics 12 (21): 4389
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2023,
Acri G, Campanella F, Vermiglio G, Anfuso C, Testagrossa B, Cavallaro D, Urzi D, Sanzo A, D'Avanzo MA, Hartwig V
Appl Sci 13 (20): 11414
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2023,
Bharadwaj IS, Kumar S, Kumar V
TENCON 2023 - 2023 IEEE Region 10 Conference (TENCON), Chiang Mai, Thailand. IEEE: S. 130-133; ISBN 9798350302202
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2023,
Wang T, Li B, Zhao K, Yu Q, Xu L, Chi Y, Guan S
Electronics 12 (20): 4231
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2023,
Sowder T, Sayed D, Concannon T, Pew SH, Strand NH, Abd-Elsayed A, Wie CS, Gomez Ramos DE, Raslan AM, Deer TR
J Pain Res 16: 3693-3706
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2023,
Long T, Jiang C, Li L
2023 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Leuven, Belgium. IEEE: S. 67-69; ISBN 978-1-6654-9218-8
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Neurophysiol Clin 53 (6): 102916
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2023,
Alsing KK, Olsen O, Koch CB, Hansen RH, Persson DP, Qvortrup K, Serup J
Case Rep Dermatol 15 (1): 85-92
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2023,
Tiwari RN, Sharma D, Singh P, Kaim V, Khan T, Kanaujia BK
IEEE Trans Antennas Propag 71 (10): 8326-8331
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2023,
Hu Y, Yang K, Liu H, Wang L, Wang S, Zhang X, Qu B, Yang H
Front Bioeng Biotechnol 11: 1259255
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2023,
Wagih M, Balocchi L, Benassi F, Carvalho NB, Chiao JC, Correia R, Costanzo A, Cui Y, Georgiadou D, Gouveia C, Grosinger J, Ho JS, Hu K, Komolafe A, Lemey S, Loss C, Marrocco G, Mitcheson P, Palazzi V, Panunzio N, Paolini G, Pinho P, Preishueber-Pflugl J, Qaragoez Y, Rahmani H, Rogier H, Lopera JR, Roselli L, Schreurs D, Tentzeris M, Tian X, Torah R, Torres R, Van Torre P, Vital D, Beeby S
IEEE J Microw 3 (1): 193-226
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2023,
Violante IR, Alania K, Cassarà AM, Neufeld E, Acerbo E, Carron R, Williamson A, Kurtin DL, Rhodes E, Hampshire A, Kuster N, Boyden ES, Pascual-Leone A, Grossman N
Nat Neurosci 26 (11): 1994-2004
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2023,
Govindan T, Palaniswamy SK, Kanagasabai M, Kumar S, Agarwal R, Kumar R, Panigrahy D
IEEE Sens J 23 (22): 28150-28158
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2023,
Gross D, Scandling B, Leewood AR, Simonetti OP
Biomed Phys Eng Express 9 (6): 065025
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2023,
Chen B, Dammann P, Jabbarli R, Sure U, Quick HH, Kraff O, Wrede KH
PLoS One 18 (10): e0292666
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2023,
Fu S, Yi S, Ke Q, Liu K, Xu H
ACS Nano 17 (20): 19652–19666