Die folgenden Begriffe wurden einbezogen:
Frequenz, frequency, 頻度、周波数
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2019,
Ji X, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 527-528; ISBN 978-1-7281-0693-9
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2019,
Gao G, Zhang R, Yang C, Meng H, Geng W, Hu B
IET Microwaves, Antennas & Propagation 13 (13): 2319 - 2323
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2019,
Ebadi-Shahrivar A, Fay P, Hochwald BM, Love DJ
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 1005-1006; ISBN 978-1-7281-0693-9
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2019,
Lan Q, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 1861-1862; ISBN 978-1-7281-0693-9
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2019,
Song S, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 1009-1010; ISBN 978-1-7281-0693-9
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 744-747; ISBN 978-1-7281-1639-6
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2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 766-769; ISBN 978-1-7281-1639-6
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2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 750-753; ISBN 978-1-7281-1639-6
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2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 48-51; ISBN 978-1-7281-1639-6
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2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 334-337; ISBN 978-1-7281-1639-6