Die folgenden Begriffe wurden einbezogen:
Feldstärke, "field intensity", "field strength", 電磁界強度
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2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
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2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 48-51; ISBN 978-1-7281-1639-6
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2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 334-337; ISBN 978-1-7281-1639-6
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Strahlenschutzkommission (SSK),
1-65
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2019,
Wen F, Li Q, Li R, Liu L, Wu T
2019 IEEE Innovative Smart Grid Technologies - Asia (ISGT Asia), Chengdu, China. IEEE: 4117-4121; ISBN 978-1-7281-3521-2
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2019,
Bechet AC, Helbet R, Miclaus S, Bouleanu I, Sarbu A, Bechet P
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1025-1029; ISBN 978-1-7281-0595-6
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2019,
Abasi S, Aggas JR, Venkatesh N, Vallavanatt IG, Guiseppi-Elie A
Biosens Bioelectron 147: 111793
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2019,
Schukro C, Puchner SB
Eur J Radiol 118: 96-100
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2019,
Gomez-Tames J, Tarnaud T, Miwa K, Hirata A, Van de Steene T, Martens L, Tanghe E, Joseph W
IEEE Trans Electromagn Compat 61 (6): 1944 - 1952
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2019,
Perov S, Rubtsova N, Balzano Q
Bioelectromagnetics 40 (8): 578-587
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2019,
Hensen B, Kägebein U, Gutberlet M, Ringe KI, Vo-Chieu VD, Stucht D, Speck O, Vick R, Wacker F, Pannicke E
Biomed Tech 64 (4): 373-382
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Exp Brain Res 237 (12): 3071-3088
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2019,
De Angelis A, Denzi A, Merla C, Andre FM, Garcia-Sanchez T, Mir LM, Apollonio F, Liberti M
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: 134-137; ISBN 978-1-5386-1312-2
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Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std C95.1-2019: 1-312, ISBN 978-1-5044-5548-0
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Top Magn Reson Imaging 28 (3): 145-158
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2019,
Gombarska D, Smetana M, Janousek L
2019 12th International Conference on Measurement, Smolenice, Slovakia. IEEE: 223-226; ISBN 978-1-7281-2743-9
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2019,
Shimoyama S, Chakarothai J, Wake K, Arima T, Watanabe S, Uno T
Ann Telecommun 74 (1-2): 53–65
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2019,
Schmidt S, Schüßler M, Hessinger C, Schuster C, Bertulat B, Kithil M, Cardoso MC, Jakoby R
IEEE Access 7: 78698 - 78705
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2019,
Mi Y, Li P, Liu Q, Xu J, Yang Q, Tang J
Technol Cancer Res Treat 18: 1533033819876918
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2019,
Christopoulou M, Karabetsos E
Bioelectromagnetics 40 (8): 602-605
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2019,
Frigura-Iliasa M, Baloi FI, Olariu AF, Petrenci RC
2019 20th International Scientific Conference on Electric Power Engineering (EPE), Kouty nad Desnou, Czech Republic. IEEE: 1-4; ISBN 978-1-7281-1335-7
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2019,
Mashhadi AR, Mohammadi MM, Mohtashami V
2019 27th Iranian Conference on Electrical Engineering (ICEE), Yazd, Iran. IEEE: 1664-1668; ISBN 978-1-7281-1509-2
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2019,
Mirbagheri SA, Mohammadi M
J Environ Manage 250: 109454
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2019,
Frigura-Iliasa M, Baloi FI, Olariu AF, Petrenci RC
2019 International Conference on Information and Digital Technologies (IDT), Zilina, Slovakia. IEEE: 149-152; ISBN 978-1-7281-1402-6
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2019,
Kainz A, Steiner H, Hortschitz W, Schalko J, Jachimowicz A, Keplinger F
2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), Berlin, Germany. IEEE: 2114-2117; ISBN 978-1-5386-8105-3