Die folgenden Begriffe wurden einbezogen:
Feldstärke, "field intensity", "field strength", 電磁界強度
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Prz Elektrotechniczny 95 (11): 17-21
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2019 IEEE Wireless Power Transfer Conference (WPTC), London, UK. IEEE: S. 106-110; ISBN 978-1-7281-0706-6
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2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: S. 4256-4262; ISBN 978-1-7281-3404-8
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2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: S. 1452-1458; ISBN 978-1-7281-3404-8
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2019,
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2019,
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2019 IEEE 3rd Advanced Information Management, Communicates, Electronic and Automation Control Conference (IMCEC), Chongqing, China. IEEE: S. 1977-1980; ISBN 978-1-7281-0514-7
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2019 International Multi-Conference on Industrial Engineering and Modern Technologies (FarEastCon), Vladivostok, Russia. IEEE: S. 1-5; ISBN 978-1-7281-0062-3
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2019,
Tajima K, Komeda K, Miyota Y, Hikage T
2019 International Symposium on Antennas and Propagation (ISAP), Xi'an, China. IEEE: S. 1-3; ISBN 978-1-7281-5113-7
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2019 International Conference on ENERGY and ENVIRONMENT (CIEM), Timisoara, Romania. IEEE: S. 82-85; ISBN 978-1-7281-1533-7
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2019,
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2019,
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2019 Open Innovations (OI), Cape Town, South Africa. IEEE: S. 222-225; ISBN 978-1-7281-3465-9
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2019,
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 162-165; ISBN 978-1-7281-1639-6
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2019,
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2019,
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 48-51; ISBN 978-1-7281-1639-6
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2019,
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 334-337; ISBN 978-1-7281-1639-6
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Strahlenschutzkommission (SSK),
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2019,
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2019 IEEE Innovative Smart Grid Technologies - Asia (ISGT Asia), Chengdu, China. IEEE: S. 4117-4121; ISBN 978-1-7281-3521-2
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2019,
Bechet AC, Helbet R, Miclaus S, Bouleanu I, Sarbu A, Bechet P
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: S. 1025-1029; ISBN 978-1-7281-0595-6
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2019,
Abasi S, Aggas JR, Venkatesh N, Vallavanatt IG, Guiseppi-Elie A
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2019,
Schukro C, Puchner SB
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2019,
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2019,
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2019,
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Exp Brain Res 237 (12): 3071-3088
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2019,
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2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: S. 134-137; ISBN 978-1-5386-1312-2
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Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std C95.1-2019: 1-312, ISBN 978-1-5044-5548-0