Die folgenden Begriffe wurden einbezogen:
電磁界強度, Feldstärke, "field intensity", "field strength"
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2023,
Unal G, Poon C, FallahRad M, Thahsin M, Argyelan M, Bikson M
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2023,
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2023,
Thulu FGD, Tembo D, Nyirongo R, Mzaza PJC, Kamfosi A, Mawenda UC
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2023,
Wu N, Liu H, Wang J, Zhang C, Wu C, Huo X, Zhang G
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2023,
Danzer E, Eppley E, Edgar JC, Hoffman C, Goldshore MA, Adzick NS, Hedrick HL, Victoria T
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2023,
Castro-Torres JL, Méndez J, Torres-Lugo M, Juan E
Biomed Phys Eng Express 9 (3): 035010
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2023,
Ma L, Tian S, Zhang HL, Wang JY, Wang JW, Yan HL, Hu XG, Shao Q, Guo JM
Front Public Health 11: 1103022
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Comput Struct Biotechnol J 21: 1349-1361
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2023,
Deng ZD, Robins PL, Dannhauer M, Haugen LM, Port JD, Croarkin PE
medRxiv: the Preprint Server for Health Sciences (medRxiv),
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2023,
Ye Z, Li Y, Zhao Y, Zhang J, Zhu T, Xu F, Li F
Anal Chem 95 (10): 4634-4643
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2023,
Echchgadda I, Cantu JC, Butterworth J, Gamboa B, Barnes R, Freeman DA, Ruhr FA, Williams WC, Johnson LR, Payne J, Thomas RJ, Roach WP, Ibey BL
Bioelectromagnetics 44 (1-2): 5-16
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2023,
Stroka S, Haussmann N, Zang M, Schmuelling B, Clemens M
IEEE Trans Magn 59 (5): 5000104
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2023,
Parker JE, Rodriguez RA
Biochim Biophys Acta (BBA) - Biomembranes 1865 (4): 184136
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2023,
Schneeweiss P, Hirtl R, Schmid G
J Radiol Prot 43 (1): 011514
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2023,
Ma S, Liu H, Hou J, Zhang J
J Hazard Mater 448: 130882
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2023,
Segar DJ, Bernstock JD, Arnaout O, Bi WL, Friedman GK, Langer R, Traverso G, Rampersad SM
Sci Rep 13: 1636
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2023,
Kazemivalipour E, Sadeghi-Tarakameh A, Keil B, Eryaman Y, Atalar E, Golestanirad L
PLoS One 18 (1): e0280655
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2023,
Abad V, Alejandre M, Hernández-Fernández E, Raso J, Cebrián G, Álvarez-Lanzarote I
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2023,
Panagiotakopoulos T, Kiouvrekis Y, Misthos LM, Kappas C
IEEE Access 11: 7145-7156
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2023,
Shrivastava M, Abdul-Hamid A, Zilani G, Qureishi A, Jeyaretna S, MacKeith S
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2023,
Wang B, Aberra AS, Grill WM, Peterchev AV
J Neural Eng 19 (6): 066047
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2023,
Dong X, Sun W, Lu M
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2023,
Makarov SN, Nguyen H, Meng Q, Lu H, Nummenmmaa AR, Deng ZD
J Neural Eng 20 (1): 016028
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2023,
Adda S, Anglesio L, Bogo F, Pasquino N, Trinchero S
IEEE Trans Instrum Meas 72: 1-8
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2023,
Haussmann N, Mease R, Zang M, Stroka S, Hensel H, Clemens M
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2023,
Turajlic E, Alihodzic A, Mujezinovic A
Radiat Prot Dosimetry 199 (2): 107-115
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2023,
Fluschnik N, Tahir E, Erley J, Müllerleile K, Metzner A, Wenzel JP, Guerreiro H, Adam G, Blankenberg S, Kirchhof P, Tönnis T, Nikorowitsch J
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2023,
Haussmann N, Zang M, Mease R, Schmuelling B, Clemens M
Int J Numer Model 36 (3): e3075
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2023,
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J Biophotonics 16 (1): e202200212
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2023,
De Paepe S, De Borre E, Toribio Carvajal D, Bell D, Thielens A
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2023,
Jin T, Dou Z, Zhao Y, Jiang B, Xu J, Zhang B, Wei B, Dong F, Zhang J, Sun C
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2023,
Hardell L, Koppel T
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2022,
Wang Y, Hu H, Shang H, Peng T
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J Radiat Proc 40 (2): 42-53
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New Physics: Sae Mulli 72 (11): 835-840
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J Radiat Proc 40 (3): 88-97
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J Radiat Proc 40 (5): 050601
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2022,
Kopacz T, Bornkessel C, Wuschek M
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2022 8th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE), Ruse, Bulgaria. IEEE: S. 1-4; ISBN 978-1-6654-0710-6
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2022,
Zumbo S, Isernia T, Bevacqua MT
IEEE Open Journal of Antennas and Propagation 3: 917-931
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2022,
Ali K, Cosmas J, Zhang Y, Zhang H, Meunier B, Jawad N, Zhang X, Shi L, Gbadamosi J, Savov A
IEEE Trans Broadcast 68 (1): 156-170
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2022,
Ursăchianu MV, Lăzărescu C, Bejenaru O, Sălceanu A
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2022,
Sanchez Aquino JM, Arroyo Pizarro A, Amaya Fariño LM, Jaramillo Chamba DA, Jaramillo Infante MK
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2022,
Li Y, Liu D, Zhang J, Wu L
2022 International Conference on Mechanical and Electronics Engineering (ICMEE), Xi'an, China. IEEE: S. 162-166; ISBN 978-1-6654-9221-8
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2022 International Conference on Computing, Communication, and Intelligent Systems (ICCCIS), Greater Noida, India. IEEE: S. 383-388; ISBN 978-1-6654-6201-3
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2022,
Cresci A, Durif CMF, Larsen T, Bjelland R, Skiftesvik AB, Browman HI
PNAS Nexus 1 (4): pgac175
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2022,
Pustake S, Upadhyaya V, Bundele M
2022 IEEE Pune Section International Conference (PuneCon), Pune, India. IEEE: S. 1-7; ISBN 978-1-6654-9898-2
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2022,
Singh MM, Chandel P, Pati A, Parganiha A
Biol Rhythm Res 53 (9): 1414-1438
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2022,
Miclaus S, Deaconescu DB, Vatamanu D, Buda AM
2022 International Symposium on Electronics and Telecommunications (ISETC), Timisoara, Romania. IEEE: S. 1-4; ISBN 978-1-6654-5151-2
