Die folgenden Begriffe wurden einbezogen:
平板培養, Ausplattierung, plating
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2021,
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2021,
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2021,
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2021 Second International Symposium on Instrumentation, Control, Artificial Intelligence, and Robotics (ICA-SYMP), Bangkok, Thailand. IEEE: S. 1-6; ISBN 978-1-7281-8761-7
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2021,
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2021,
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2020 IEEE Transportation Electrification Conference & Expo (ITEC), Chicago, IL, USA. IEEE: S. 1201-1207; ISBN 978-1-7281-4630-0
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2020 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Toulouse, France. IEEE: S. 1-4; ISBN 978-1-7281-5867-9
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2020,
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2020 IEEE International Symposium on Antennas and Propagation and North American Radio Science Meeting, Montreal, QC, Canada. IEEE: S. 1435-1436; ISBN 978-1-7281-6671-1
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2020 IEEE 1st China International Youth Conference on Electrical Engineering (CIYCEE), Wuhan, China. IEEE: S. 1-5; ISBN 978-1-7281-9660-2
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2020,
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2020 IEEE International Conference on Information Technology,Big Data and Artificial Intelligence (ICIBA), Chongqing, China. IEEE: S. 798-802; ISBN 978-1-7281-5225-7
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2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI, USA. IEEE: S. 5185-5192; ISBN 978-1-7281-5827-3
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2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 270-275; ISBN 978-1-7281-7431-0
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2020,
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2020 IEEE 3rd International Conference on Electronics Technology (ICET), Chengdu, China. IEEE: S. 531-535; ISBN 978-1-7281-6284-3
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2020,
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2020,
Zhao Y, Zheng S, Beitel-White N, Liu H, Yao C, Davalos RV
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