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IEEE Trans Compon Packaging Manuf Technol 9 (7): 1253-1263
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2019,
Yamanaka D, Takahashi M
2019 Wireless Days (WD), Manchester, UK. IEEE: S. 1-4; ISBN 978-1-7281-0118-7
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2019,
Bardati F, Di Carlofelice A, Tognolatti P
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: S. 2538-2546; ISBN 978-1-7281-3404-8
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2019,
Becker G, Brandt R, Viertel T
Bundesamt für Strahlenschutz (BfS),
Ressortforschungsberichte zum Strahlenschutz, BfS-RESFOR-150/19: 1-52
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Bundesamt für Strahlenschutz (BfS),
Ressortforschungsberichte zum Strahlenschutz, BfS-RESFOR-155/19: 1-122
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2019,
Ortego-Isasa I, Martins A, Birbaumer N, Ramos-Murguialday A
2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), San Francisco, CA, USA. IEEE: S. 381-384; ISBN 978-1-5386-7922-7
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2019,
Graybill P, Kiani M
IEEE Trans Biomed Circuits Syst 13 (1): 203-213
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2019,
Wang C, Liang X, Freschi F
2019 IEEE Industry Applications Society Annual Meeting, Baltimore, MD, USA. IEEE: S. 1-8; ISBN 978-1-5386-4540-6
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2019 International Multi-Conference on Industrial Engineering and Modern Technologies (FarEastCon), Vladivostok, Russia. IEEE: S. 1-4; ISBN 978-1-7281-0062-3
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2019,
Wu I, Matsumoto Y, Gotoh K, Wake K, Watanabe S
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: S. 169-172; ISBN 978-1-7281-0595-6