Die folgenden Begriffe wurden einbezogen:
"vierte Mobilfunk-Generation", 4G, "fourth generation of mobile communications", 第4世代移動通信
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Technol Health Care 32 (1): 103-115
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2024,
Chiaraviglio L, Lodovisi C, Bartoletti S, Elzanaty A, Slim- Alouini M
IEEE Trans Mob Comput 23 (3): 2284-2302
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2023,
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2023 IEEE Third International Conference on Signal, Control and Communication (SCC), Hammamet, Tunisia. IEEE: S. 1-6; ISBN 9798350326406
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2023,
Tsuruga S, Omiya M, Miyashita C, Sugimura K, Yamazaki K, Tamura N, Hikage T, Ikeda-Araki A, Kishi R
2023 IEEE International Symposium On Antennas And Propagation (ISAP), Kuala Lumpur, Malaysia. IEEE: S. 1-2; ISBN 9798350341157
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2023,
El Ghabzouri M, Salhi AE, Mendes PM
2023 IEEE Integrated STEM Education Conference (ISEC), Laurel, MD, USA. IEEE: S. 410-413; ISBN 9798350300024
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023 IEEE 13th International Conference on Consumer Electronics - Berlin (ICCE-Berlin), Berlin, Germany. IEEE: S. 216-219; ISBN 9798350324167
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2023,
Tian R, Wu YQ, Lu M, Miao XF
Electronics 12 (21): 4389
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2023,
Miclaus S, Deaconescu DB, Vatamanu D, Buda AM
Technologies 11 (5): 113
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2023,
Ajibare AT, Oladejo SO, Ekwe SO, Akinyemi LA, Ramotsoela D
SAIEE Afr Res J 114 (4): 114-127
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Appl Sci 13 (19): 10621
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2023,
Adda S, Chiaraviglio L, Franci D, Lodovisi C, Pasquino N, Pavoncello S, Pedroli C, Pelosini R
IEEE Trans Instrum Meas 72: 5504410
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2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: S. 1-5; ISBN 9798350324013
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2023,
Ramos V, Suárez SD, Marina P, Febles VM, Rabassa LE, Hernández JA
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: S. 1-6; ISBN 9798350324013
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2023,
Islam MS, Islam MM, Rahman MM, Islam K
Vet Med Sci 9 (6): 2648-2659
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2023,
Shib B, Yeasar SMS, Hassan M, Islam R, Islam AKME
2023 International Conference on Communications, Computing and Artificial Intelligence (CCCAI), Shanghai, China. IEEE: S. 12-16; ISBN 9798350311303
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2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: S. 608-613; ISBN 9798350309775
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2023,
Minoretti P, Lahmar A, Emanuele E
Radiol Case Rep 18 (11): 3984-3987
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2023,
Kopacz T, Schiffarth AM, Wuschek M, Bornkessel C
Landesamt für Natur, Umwelt und Verbraucherschutz Nordrhein-Westfalen (LANUV),
LANUV-Fachbericht 143: 1-138
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2023,
Djuric N, Skoric T, Kljajic D, Otasevic V, Djuric S
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: S. 1856-1861; ISBN 9798350312850
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2023,
Manassas A, Apostolidis C, Iakovidis S, Babas D, Samaras T
Sci Rep 13: 13784
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2023,
Prasad D, Kudva V, Singh A, Hegde RB, Rukmini PG
Crit Rev Biomed Eng 51 (5): 1-25
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2023,
Loizeau N, Zahner M, Schindler J, Stephan C, Fröhlich J, Gugler M, Ziegler T, Röösli M
Environ Res 237 Pt 1: 116921
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2023,
Yu Z, Niu R, Zhang G, Sun R, Lin Z, Li Y, Ran X
IEEE Access 11: 87930-87937
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2023,
Faye S, Camino R, Rziga G, Sarvari PA, Al-Naffakh N, Estrada-Jiménez JC, Pardo E, Khadraoui D
IEEE Access 11: 85927-85950
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2023,
Yi M, Wu B, Zhao Y, Su T, Chi Y
Appl Sci 13 (14): 8107