Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 1-21; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 751-756; ISBN 978-4-88552-287-1
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2014,
Bit-Babik G, Faraone A
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 1-6; ISBN 978-4-88552-287-1
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2014,
Sarolic A, Modlic B, Roje V, Poljak D, Pavic P
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 969-973; ISBN 978-4-88552-287-1
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2014,
Bitz A, Alaydrus M, Streckert J, Hansen VW
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 747-750; ISBN 978-4-88552-287-1
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2014,
Ruffilli L, D'Elia S, Barabino A
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 1-6; ISBN 978-4-88552-287-1
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2014,
Flintoft ID, Porter SJ, Capstick MH, Marvin AC
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 1-6; ISBN 978-4-88552-287-1
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2014,
Herschlein A, Baldauf M, Sörgel W, Wiesbeck W
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 1-4; ISBN 978-4-88552-287-1
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2014,
Bernardi P, Cicchetti R, Testa O
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 1-5; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 1-6; ISBN 978-4-88552-287-1