Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2017 IEEE Conference on Antenna Measurements & Applications (CAMA), Tsukuba, Japan. IEEE, Tsukuba, Japan: S. 142-143; ISBN 978-1-5090-5029-1
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2017,
Shi J, Chakarothai J, Wang J, Wake K, Fujiwara O, Watanabe S
2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing), Beijing, China. IEEE; ISBN 978-1-5090-5186-1
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Elektromagnetische Verträglichkeit in der Kfz-Technik: Beiträge der 7. GMM-Fachtagung, 2017. VDE/VDI-Gesellschaft Mikroelektronik Mikrosystem- und Feinwerktechnik (GMM): S. 23-28; ISBN 978-3-8007-4460-2
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2017,
Bärenfänger J, Cuartielles D, Kürschner D, Maarleveld M
Elektromagnetische Verträglichkeit in der Kfz-Technik: Beiträge der 7. GMM-Fachtagung, 2017. VDE/VDI-Gesellschaft Mikroelektronik Mikrosystem- und Feinwerktechnik (GMM): S. 7-16; ISBN 978-3-8007-4460-2
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2017,
Putro EM, Sulistya B, Septiawan R, Rufiyanto A, Trihatmo S, Hamidah M
2017 International Conference on Control, Electronics, Renewable Energy and Communications (ICCREC), Yogyakarta, Indonesia. IEEE; ISBN 978-1-5386-2746-4
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2017,
Yavolovskaya E, Willmann B, Gabriadze G, Chiqovani G, Sukhiashvili Z, Iosava S, Svanidze L, Jobava R
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2017,
De Miguel-Bilbao S, Blas J, Aguirre E, Iturri PL, Azpilicueta L, Falcone F, Ramos V
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2017,
Kurnaz C, Engiz BK, Turgut A
2017 IV International Electromagnetic Compatibility Conference (EMC Turkiye), Ankara, Turkey. IEEE, Ankara, Turkey; ISBN 978-1-5090-4821-2
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2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2017,
Jomaa K, Ndagijimana F, Ayad H, Fadlallah M, Jomaah J
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2017,
Gabriadze G, Chiqovani G, Yavolovskaya E, Svanidze L, Karkashadze D, Jobava R
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2017,
Karpowicz J, De Miguel-Bilbao S, Ramos V, Falcone F, Gryz K, Leszko W, Zradziński P
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong RYC, Lo WK
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2017,
Yang R, Zheng J, Chen J, Kainz W
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2017,
Oganezova I, Pommerenke D, Zhou J, Ghosh K, Hosseinbeig A, Lee J, Tsitskishvili N
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA. IEEE; ISBN 978-1-5386-2232-2
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2017,
Dürrenberger G, Leuchtmann P, Röösli M, Siegrist M, Sütterlin B
Bundesamt für Energie (BFE),
1-125
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2017,
Hikage T, Yamagishi M, Shindo K, Nojima T
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong R
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2017,
Mishra SK, Chowdhary R, Kumari S, Rao SB
J Clin of Diagn Res 11 (5): ZE01-ZE05
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2017,
Capstick MH, Kuehn S, Berdinas-Torres V, Gong Y, Wilson PF, Ladbury JM, Koepke G, McCormick DL, Gauger J, Melnick RL, Kuster N
IEEE Trans Electromagn Compat 59 (4): 1041-1052
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2017,
Gong Y, Capstick M, Kuehn S, Wilson P, Ladbury J, Koepke G, McCormick DL, Melnick RL, Kuster N
IEEE Trans Electromagn Compat 59 (6): 1798-1808
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2017,
Takei R, Nagaoka T, Saito K, Watanabe S, Takahashi M
IEEE Trans Electromagn Compat 59 (2): 747-753
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2017,
Wake K, Laakso I, Hirata A, Chakarothai J, Onishi T, Watanabe S, De Santis V, Feliziani M, Taki M
IEEE Trans Electromagn Compat 59 (2): 677 - 685
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2017,
Laakso I, Morimoto R, Hirata A
IEEE Trans Electromagn Compat 59 (2): 739-746
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2017,
Senic D, Sarolic A, Holloway CL, Ladbury JM
IEEE Trans Electromagn Compat 59 (3): 813 - 822