Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
-
2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 413-418; ISBN 9798350309775
-
2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 608-613; ISBN 9798350309775
-
2023,
Muramatsu D, Kodama M
AIP Adv 13 (8): 085022
-
2023,
Hwata C, Rushingabigwi G, Gatera O, Twizere C, Mukanyiligira D, Thomas BN
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: 1389-1396; ISBN 9798350312850
-
2023,
Kataja J, Nissi J, Roine T, Laakso I
IEEE Trans Electromagn Compat 65 (6): 1647-1655
-
2023,
Voicu V, Dina LA, Mircea PM, Dumbrava I
2023 Power Quality and Electromagnetic Compatibility at Low Frequency (PQEMC-LF), Craiova, Romania. IEEE: 61-64; ISBN 9798350341348
-
2023,
Kuchina AP, Zakirova EA
2023 Systems of Signal Synchronization, Generating and Processing in Telecommunications (SYNCHROINFO), Pskov, Russian Federation. IEEE: 1-4; ISBN 9798350348323
-
IEEE Trans Electromagn Compat 65 (5): 1282-1291
-
2023,
Souček T, Richter A, Morava J, Slavík L
2023 5th International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Istanbul, Turkiye. IEEE: 1-4; ISBN 9798350337532
-
2023,
Campi T, Cruciani S, Maradei F, Feliziani M
Energies 16 (9): 3822
-
2023,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Joseph W
IEEE Trans Electromagn Compat 65 (4): 960-971
-
IEEE Trans Electromagn Compat 65 (4): 1090-1097
-
2023,
Yao M, Zhekov SS, Xu B, Li K, Zhang S
IEEE Trans Electromagn Compat 65 (5): 1292-1299
-
2023,
Li Y, Ying Y, Xie K, Pan S
IEEE Trans Electromagn Compat 65 (3): 643-654
-
2023,
Orlacchio R, Andrieu G, Joushomme A, Patrignoni L, Hurtier A, Poulletier de Gannes F, Lagroye I, Percherancier Y, Arnaud-Cormos D, Leveque P
IEEE Trans Electromagn Compat 65 (1): 39-50
-
2022,
Li E, Li XJ, Seet BC
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 101-104; ISBN 978-1-6654-2776-0
-
2022,
Yang X, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 606-609; ISBN 978-1-6654-0930-8
-
2022,
Li Y, Liu D, Zhang J, Wu L
2022 International Conference on Mechanical and Electronics Engineering (ICMEE), Xi'an, China. IEEE: 162-166; ISBN 978-1-6654-9221-8
-
2022,
Bräunlich R, Dalmus C, Dongus S, Eberhard J, Friedrich G, Fröhlich J, Röösli M, Schürmann D
Bundesamt für Energie (BFE),
Statusbericht 2022: 1-204
-
2022,
Krupski P, Michalowska J
Prz Elektrotechniczny 98 (12): 217-220
-
2022,
David A, Tiemann M, Schmuelling B, Haussmann N, Stroka S, Clemens M
2022 Second International Conference on Sustainable Mobility Applications, Renewables and Technology (SMART), Cassino, Italy. IEEE: 1-6; ISBN 978-1-6654-7147-3
-
IEEE Electromagn Compat Mag 11 (3): 20-21
-
2022,
Beard BB, Iacono MI, Guag JW, Liu Y
IEEE Electromagn Compat Mag 11 (3): 49-54
-
2022,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A, Shakinka I
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 537-542; ISBN 978-1-6654-0789-2
-
2022,
Pavel I, David V, Roman MG, Bordas AM
2022 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 484-488; ISBN 978-1-6654-8995-9
-
2022,
Xia M, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 610-613; ISBN 978-1-6654-0930-8
-
2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: 319-322; ISBN 978-1-6654-2776-0
-
2022,
Diao Y, Rashed EA, Hirata A
IEEE Trans Electromagn Compat 64 (6): 1969-1977
-
2022,
Colombi D, Ghasemifard F, Joshi P, Xu B, Di Paola C, Törnevik C
IEEE Trans Electromagn Compat 64 (6): 1986-1993
-
2022,
ElShami IF, Elwrfalli K, Elgayar AI, Elgaud MM, Yousuf FH, Elmangosh N
2022 International Conference on Engineering & MIS (ICEMIS), Istanbul, Turkey. IEEE: 1-5; ISBN 978-1-6654-5437-7
-
2022,
Li S, Jiang Y, Tang C, Luo Z, Liu L, Li Z, Gu C
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 563-565; ISBN 978-1-6654-1672-6
-
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 525-530; ISBN 978-1-6654-0789-2
-
2022,
Silla G, Bastianelli L, Colella E, Moglie F, Primiani VM
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 151-156; ISBN 978-1-6654-0789-2
-
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 145-150; ISBN 978-1-6654-0789-2
-
2022,
Hammen L, Pichon L, Le Bihan Y, Bensetti M, Fleury G
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 114-119; ISBN 978-1-6654-0789-2
-
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 311-316; ISBN 978-1-6654-0789-2
-
2022,
Esmaeili H, Yang C, Schuster C
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 467-472; ISBN 978-1-6654-0789-2
-
2022,
Marina P, Suárez SD, Hernández JA, Febles VM, Rabassa LE, Ramos V
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 519-524; ISBN 978-1-6654-0789-2
-
2022,
Johansson M, Carlsson J
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 137-140; ISBN 978-1-6654-0789-2
-
2022,
Zhou C, Synder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: 439-442; ISBN 978-1-6654-0930-8
-
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 306-308; ISBN 978-1-6654-1672-6
-
2022,
Guo R, Xia M, Zheng J, Chen J, Shrivastava D
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 210-212; ISBN 978-1-6654-1672-6
-
2022,
Li J, Changyuan W, Yujie Z
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: 261-263; ISBN 978-1-6654-1672-6
-
2022,
Duris V, Ivanov VN, Chumarov SG
TEM J 11 (2): 920-925
-
2022,
Grazian F, Shi W, Soeiro TB, Dong J, Bauer P
2022 Wireless Power Week (WPW), Bordeaux, France. IEEE: 54-59; ISBN 978-1-6654-8446-6
-
2022,
Zimmer S, Helwig M, Winkler A, Modler N
Electronics 11 (14): 2156
-
2022,
Kapetanović AL, Poljak D
IEEE Trans Electromagn Compat 64 (5): 1296-1303
-
Energies 15 (12): 4455
-
2022,
Bertoluzzo M, Di Barba P, Forzan M, Mognaschi ME, Sieni E
Eng Comput 39 (7): 2802-2819
-
2022,
Yang B, Chen CH, Graham SJ
IEEE Letters on Electromagnetic Compatibility Practice and Applications 4 (3): 83-87