Die folgenden Begriffe wurden einbezogen:
thermic, thermisch, thermal, 熱の
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2020,
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2020 International Multi-Conference on Industrial Engineering and Modern Technologies (FarEastCon), Vladivostok, Russia. IEEE: 1-6; ISBN 978-1-7281-6952-1
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2020,
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2020,
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2020,
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2020,
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2020,
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2020,
Zhao J, Wu Z, Yang T, Zhao Y, Wang L
IEEE Access 8: 205558-205567
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2020 SoutheastCon, Raleigh, NC, USA. IEEE: 1-4; ISBN 978-1-7281-6862-3
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2020,
Di Francesco A, De Santis V
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-5; ISBN 978-1-7281-5580-7
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2020,
Ouadah NS, Blazy K, Villégier AS
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2020,
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2020 IEEE/MTT-S International Microwave Symposium (IMS), Los Angeles, CA, USA. IEEE: 508-511; ISBN 978-1-7281-6816-6
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2020,
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IEEE Letters on Electromagnetic Compatibility Practice and Applications 2 (3): 85-91
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2020,
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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Montreal, QC, Canada. IEEE: 6107-6110; ISBN 978-1-7281-1991-5
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2020,
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2020,
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2020,
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2020 International Conference on Computational Intelligence for Smart Power System and Sustainable Energy (CISPSSE), Keonjhar, Odisha, India. IEEE: 1-4; ISBN 978-1-7281-7275-0
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2020,
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2020,
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2020,
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2020,
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2020,
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2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 270-275; ISBN 978-1-7281-7431-0
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2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 261-265; ISBN 978-1-7281-7431-0
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IEEE Transactions on Vehicular Technology 69 (10): 11841-11856
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2020,
Wang B, Li J, Jin H, Chen X
2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Montreal, QC, Canada. IEEE: 2516-2519; ISBN 978-1-7281-1991-5