-
2022,
Caramazza L, Paffi A, Liberti M, Apollonio F
2021 51st European Microwave Conference (EuMC), London, United Kingdom. IEEE: S. 785-788; ISBN 978-1-6654-4721-8
-
2022,
Gasperini D, Costa F, Daniel L, Manara G, Genovesi S
2022 Sixteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials), Siena, Italy. IEEE: X-151-X-153; ISBN 978-1-6654-6585-4
-
2022,
Kang W, Ju C, Joo J, Lee J, Shon YM, Park SM
Nat Commun 13: 7805
-
2022,
So E, Yeon P, Chichilnisky EJ, Arbabian A
IEEE J Solid-State Circuits 57 (11): 3429-3441
-
2022,
Nakamura M, Ikeda A, Tajima T, Seyama M
2022 Asia-Pacific Microwave Conference (APMC), Yokohama, Japan. IEEE: S. 940-942; ISBN 978-1-6654-5108-6
-
2022,
Godeneli K, Bengi U, Kati OA, Dumanli S
IEEE Trans Antennas Propag 70 (2): 868-875
-
2022,
Ibrahim A, Tetik E, Karamzadeh S
2022 30th Signal Processing and Communications Applications Conference (SIU), Safranbolu, Turkey. IEEE: S. 1-4; ISBN 978-1-6654-5093-5
-
2022,
Zhu L, Hà TD, Chen YH, Huang H, Chen PY
IEEE Trans Biomed Circuits Syst 16 (1): 129-137
-
2022,
Gökdemir M, Saeidi T, Karamzadeh S, Akleman F
2022 30th Signal Processing and Communications Applications Conference (SIU), Safranbolu, Turkey. IEEE: S. 1-4; ISBN 978-1-6654-5093-5
-
2022,
Gupta J, Das P, Chowdhary AK, Bhattacharjee R, Sikdar D
2022 IEEE Photonics Conference (IPC), Vancouver, BC, Canada. IEEE: S. 1-2; ISBN 978-1-6654-3488-1
-
2022,
Alvarez-Botero GA, Hernandez-Gomez YK, Lobato-Morales H
IEEE Trans Instrum Meas 71: 5502609
-
2022,
Das P, Gupta J, Sikdar D, Bhattacharjee R
2022 IEEE Silchar Subsection Conference (SILCON), Silchar, India. IEEE: S. 1-5; ISBN 978-1-6654-7101-5
-
2022,
Pei L, Du C, Shi C, Peng H
2022 7th International Conference on Communication, Image and Signal Processing (CCISP), Chengdu, China. IEEE: S. 371-375; ISBN 978-1-6654-5960-0
-
2022,
Das P, Gupta J, Sikdar D, Bhattacharjee R
2022 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON), Bangalore, India. IEEE: S. 444-448; ISBN 978-1-6654-5204-5
-
2022,
Xu Z, Rodriguez-Villegas E
2022 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Glasgow, Scotland, United Kingdom. IEEE: S. 873-876; ISBN 978-1-7281-2783-5
-
2022,
Ali K, Cosmas J, Zhang Y, Zhang H, Meunier B, Jawad N, Zhang X, Shi L, Gbadamosi J, Savov A
IEEE Trans Broadcast 68 (1): 156-170
-
2022,
Sanchez Aquino JM, Arroyo Pizarro A, Amaya Fariño LM, Jaramillo Chamba DA, Jaramillo Infante MK
Guarda T, Portela F, Augusto MF (Hrsg.): Advanced Research in Technologies, Information, Innovation and Sustainability. Communications in Computer and Information Science, Band 1676; Springer, Cham; S. 205-217; ISBN 978-3-031-20315-2
-
2022,
Ntasiopoulou C, Nasios G, Messinis L, Nousia A, Siokas V, Dardiotis E
Vlamos P (Hrsg.): GeNeDis 2022. Advances in Experimental Medicine and Biology, Band 1425; Springer, Cham; S. 619-628; ISBN 978-3-031-31985-3
-
2022,
Papanikolaou K, Nasios G, Nousia A, Siokas V, Messinis L, Dardiotis E
Vlamos P (Hrsg.): GeNeDis 2022. Advances in Experimental Medicine and Biology, Band 1425; Springer, Cham; S. 567-574; ISBN 978-3-031-31985-3
-
2022,
Yang X, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: S. 606-609; ISBN 978-1-6654-0930-8
-
2022,
Tanabe S, O'Brien J, Tollefsen KE, Kim Y, Chauhan V, Yauk C, Huliganga E, Rudel RA, Kay JE, Helm JS, Beaton D, Filipovska J, Sovadinova I, Garcia-Reyero N, Mally A, Poulsen SS, Delrue N, Fritsche E, Luettich K, La Rocca C, Yepiskoposyan H, Klose J, Danielsen PH, Esterhuizen M, Jacobsen NR, Vogel U, Gant TW, Choi I, FitzGerald R, The Mystery of ROS Consortium
Front Toxicol 4: 887135
-
2022,
Barani N, Sarabandi K, Kotov NA, VanEpps JS, Elvati P, Wang Y, Violi A
IEEE Access 10: 39344-39361
-
2022,
Jiang Q, Wei R, Gong L, Zhao R
Cell Mol Biol 68 (10): 69-72
-
2022,
Antczak JM, Dębowska W, Poleszczyk A, Kaźmierski J, Rymaszewska J, Waszkiewicz N, Wichniak A
Psychiatr Pol 56 (6): 1165-1184
-
2022,
Sakhrani N, Stefani RM, Setti S, Cadossi R, Ateshian GA, Hung CT
Appl Sci 12 (23): 12406