Die folgenden Begriffe wurden einbezogen:
percentile, Perzentil, 百分位数
-
2024,
Di Paola C, Joshi P, Colombi D, Xu B, Eilers Bischoff J, Zhekov SS, Törnevik C
IEEE Antennas Wirel Propag Lett [im Druck]
-
IEEE Trans Electromagn Compat [im Druck]
-
2024,
Yamaguchi-Sekino S, Ikuyo M, Tobita K, Onishi T, Taki M, Watanabe S
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, Brugge, Belgium. IEEE: S. 573-578; ISBN 9798350343045
-
2024,
Karpowicz J, Miclaus S
2024 IEEE International Symposium on Measurements & Networking (M&N), Rome, Italy. IEEE: S. 1-6; ISBN 9798350370546
-
2024,
Ahmad Bakir A, Martin DM, Alduraywish A, Dokos S, Loo CK
J ECT [im Druck]
-
2024,
Joshi P, Colombi D, Xu B, Di Paola C, Eilers Bischoff J, Zhekov SS, Törnevik C
2024 18th European Conference on Antennas and Propagation (EuCAP), Glasgow, United Kingdom. IEEE: S. 1-5; ISBN 9798350394436
-
2024,
Buonanno G, Costanzo S
IEEE Trans Antennas Propag 72 (5): 4051-4063
-
2024,
Bhatt CR, Henderson S, Sanagou M, Brzozek C, Thielens A, Benke G, Loughran S
Environ Res 251 Pt 2: 118629
-
2024,
Feychting M, Schüz J, Toledano MB, Vermeulen R, Auvinen A, Harbo Poulsen A, Deltour I, Smith RB, Heller J, Kromhout H, Huss A, Johansen C, Tettamanti G, Elliott P
Environ Int 185: 108552
-
2024,
Abbott CC, Miller J, Farrar D, Argyelan M, Lloyd M, Squillaci T, Kimbrell B, Ryman S, Jones TR, Upston J, Quinn DK, Peterchev AV, Erhardt E, Datta A, McClintock SM, Deng ZD
Neuropsychopharmacology 49 (4): 640-648
-
2023,
Gryz K, Karpowicz J, Zradziński P
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: S. 1-5; ISBN 9798350324013
-
2023,
Odutola MK, van Leeuwen MT, Bruinsma FJ, Benke G, Turner MC, Trotman J, Turner J, Seymour JF, Prince HM, Milliken ST, Tiley C, Hertzberg M, Roncolato F, Opat S, Lindeman R, Verner E, Underhill CR, Cardis E, Giles G, Vajdic CM
Occup Environ Med 80 (10): 599-602
-
2023,
Van Hoornweder S, Nuyts M, Frieske J, Verstraelen S, Meesen RLJ, Caulfield KA
NeuroImage 281: 120379
-
2023,
Kataja J, Nissi J, Roine T, Laakso I
IEEE Trans Electromagn Compat 65 (6): 1647-1655
-
2023,
Loizeau N, Zahner M, Schindler J, Stephan C, Fröhlich J, Gugler M, Ziegler T, Röösli M
Environ Res 237 Pt 1: 116921
-
2023,
Tognola G, Benini M, Bonato M, Gallucci S, Parazzini M
Sensors 23 (15): 6802
-
2023,
Seyfrydova M, Rokyta R, Rajdl D, Huml M
Clin Res Cardiol 112 (12): 1835-1847
-
2023,
Guillen A, Abbott CC, Deng ZD, Huang Y, Pascoal-Faria P, Truong DQ, Datta A
Front Psychiatry 14: 1168672
-
2023,
Gao Y, Qi D, Li C, Zhao H
2023 4th International Conference on Computer Engineering and Application (ICCEA), Hangzhou, China. IEEE: S. 56-60; ISBN 9798350347555
-
2023,
Diao Y, Rashed EA, Giaccone L, Laakso I, Li C, Scorretti R, Sekiba Y, Yamazaki K, Hirata A
IEEE Access 11: 38739-38752
-
2023,
Van Hoornweder S, Nuyts M, Frieske J, Verstraelen S, Meesen RLJ, Caulfield KA
bioRxiv: the Preprint Server for Biology (bioRxiv),
2023.02.22.529540
-
2023,
Fu Z, Abbott CC, Miller J, Deng ZD, McClintock SM, Sendi MSE, Sui J, Calhoun VD
Transl Psychiatry 13: 43
-
2023,
Xi J, Christ A, Kuster N
Phys Med Biol 68 (3): 035007
-
2023,
Haussmann N, Zang M, Mease R, Schmuelling B, Clemens M
Int J Numer Model 36 (3): e3075
-
2022,
Yang X, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: S. 606-609; ISBN 978-1-6654-0930-8