-
2018,
Nakagawa H, Ohuchi M
IEEE Trans Magn 54 (11): 1-5
-
2018,
Khan A, Bashir S, Ullah F
2018 International Conference on Computing, Mathematics and Engineering Technologies (iCoMET), Sukkur, Pakistan. IEEE: 1-4; ISBN 978-1-5386-1371-9
-
2018,
Okuyucu S, Yegin K, Secmen M, Özbakis B
2018 22nd International Microwave and Radar Conference (MIKON), Poznan, Poland. IEEE: 308-311; ISBN 978-1-5386-3723-4
-
2018,
Vornicu S, Lunca E, Salceanu A
2018 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 630-633; ISBN 978-1-5386-5063-9
-
2018,
Islam SS, Chowdhury A, Paul N, Ahmed S
2018 9th IEEE Annual Ubiquitous Computing, Electronics & Mobile Communication Conference (UEMCON), New York City, NY, USA. IEEE: 1038-1041; ISBN 978-1-5386-7694-3
-
2018,
Beygi M, Mumcu G, Saddow SE
SoutheastCon 2018, St. Petersburg, FL, USA. IEEE: 1-2; ISBN 978-1-5386-6134-5
-
2018,
Manoufali M, Abbosh A
2018 IEEE International Symposium on Antennas and Propagation & USNC/URSI National Radio Science Meeting, Boston, MA, USA. IEEE: 215-216; ISBN 978-1-5386-7103-0
-
2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: 1-2; ISBN 978-1-5386-5922-9
-
International Electrotechnical Commission (IEC),
IEC 60479-1:2018: 1-72, ISBN 978-2-8-3226295-5
-
2018,
Geesink HJH, Meijer DKF
Journal of Modern Physics 9 (5): 898-924
-
2018,
Teplan M, Bereta M, Bajla I, Bartosova K, Dermek T, Haba Y, Cifra M
2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: 1-2; ISBN 978-1-5386-5922-9
-
Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
DIN EN IEC 60974-1:2018-12 VDE 0544-1:2018-12
-
2018,
Malekmohammadi M, Shahriari Y, AuYong N, O'Keeffe A, Bordelon Y, Hu X, Pouratian N
J Neural Eng 15 (5): 056016
-
2018,
Arendsen LJ, Hugh-Jones S, Lloyd DM
J Pain 19 (7): 807-818
-
2018,
Kim Y, Cho HJ, Park HS
J Neuroeng Rehabil 15: 80
-
2018,
Ren Z, Leng X, Liu Q
Water Sci Technol 77 (1-2): 296-303
-
2018,
Nakagawa K, Nakazawa K
Clin Neurophysiol Pract 3: 49-53
-
2018,
Lozano-Soto E, Soto-León V, Sabbarese S, Ruiz-Alvarez L, Sanchez-Del-Rio M, Aguilar J, Strange BA, Foffani G, Oliviero A
Cephalalgia 38 (8): 1493-1497
-
2018,
Sengupta S, Balla VK
J Adv Res 14: 97-111
-
2018,
Makinistian L, Belyaev I
R Soc Open Sci 5 (2): 172095
-
2018,
Bassolino M, Franza M, Bello Ruiz J, Pinardi M, Schmidlin T, Stephan MA, Solcà M, Serino A, Blanke O
Eur J Neurosci 47 (7): 790-799
-
2018,
Koo PC, Mölle M, Marshall L
Eur J Neurosci 47 (7): 812-823
-
2018,
Foerster Á, Dutta A, Kuo MF, Paulus W, Nitsche MA
Eur J Neurosci 47 (7): 779-789
-
2018,
Dileone M, Mordillo-Mateos L, Oliviero A, Foffani G
Brain Stimul 11 (4): 676-688
-
2018,
Baute V, Keskinyan VS, Sweeney ER, Bowden KD, Gordon A, Hutchens J, Cartwright MS
Muscle Nerve 58 (2): 310-313
-
2018,
Tang AD, Bennett W, Hadrill C, Collins J, Fulopova B, Wills K, Bindoff A, Puri R, Garry MI, Hinder MR, Summers JJ, Rodger J, Canty AJ
Sci Rep 8: 4016
-
2018,
Lee SB, Kim HT, Yang HO, Jang W
Sci Rep 8: 15165
-
2018,
Santini T, Zhao Y, Wood S, Krishnamurthy N, Kim J, Farhat N, Alkhateeb S, Martins T, Koo M, Zhao T, Aizenstein HJ, Ibrahim TS
PLoS One 13 (11): e0206127
-
2018,
Aga K, Hirata A, Laakso I
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 515-520; ISBN 978-1-4673-9699-8
-
2018,
Bo W, Tang J, Ma J, Gong Y
IEEE Trans Plasma Sci 46 (7): 2562 - 2572
-
2018,
Maity S, Das D, Chatterjee B, Sen S
2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA. IEEE: 3754-3757; ISBN 978-1-5386-3647-3
-
2018,
Meijer DKF, Geesink HJH
J Cancer Ther 9 (3): 188-230
-
2018,
Wen D, Hao Y, Munoz MO, Wang H, Zhou H
IEEE Trans Antennas Propag 66 (1): 96 - 104
-
2018,
Zhao Y, Lai JJ, Wu XY, Qu W, Wang MQ, Chen L, Hu N, Wang X, Hou WS
2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA. IEEE: 2240-2243; ISBN 978-1-5386-3647-3
-
2018,
Friesen AP, Conner RL, Robinson DE, Barton WR, Chatterton S, Gillard CL
Can J Plant Sci 98 (3): 648-656
-
Institute of Electrical and Electronics Engineers (IEEE),
IEEE C95.2-2018: 1-28
-
2018,
Pabst O, Martinsen ØG, Chua L
Sci Rep 8: 15806
-
2018,
Latchoumane CV, Jackson L, Sendi MSE, Tehrani KF, Mortensen LJ, Stice SL, Ghovanloo M, Karumbaiah L
Sci Rep 8: 10957
-
International Telecommunication Union (ITU),
ITU-T Recommendations K-Series, K.90 (07/2018): 1-28
-
2018,
Rasic P, Skiljo M, Blazevic Z, Doric V, Poljak D
2018 3rd International Conference on Smart and Sustainable Technologies (SpliTech), Split, Croatia. IEEE: 1-6; ISBN 978-1-5386-6296-0
-
2018,
Buesink F, Vout-Ardatjew R, Leferink L
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 918-921; ISBN 978-1-4673-9699-8
-
2018,
Pan H, Bao Y, Cao H, Jin R, Wang P, Zhang J
Neurourol Urodyn 37 (8): 2368-2381
-
2018,
Walston ST, Chow RH, Weiland JD
J Neural Eng 15 (4): 046003
-
2018,
Sadowska U, Zabinski A, Tabor S
2018 Applications of Electromagnetics in Modern Techniques and Medicine (PTZE), Racławice, Poland. IEEE: 252-255; ISBN 978-1-5386-6937-2
-
2018,
Özgün A, Garipcan B
2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: 1-2; ISBN 978-1-5386-5922-9
-
2018,
Kaszuba-Zwoinska J, Nowak B, Guzdek P, Gil K
2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: 1-2; ISBN 978-1-5386-5922-9
-
2018,
Barabas J, Radil R, Janousek L
2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: 1-2; ISBN 978-1-5386-5922-9
-
2018 IEEE IAS Electrical Safety Workshop (ESW), Fort Worth, TX, USA. IEEE: 1-8; ISBN 978-1-5386-1560-7
-
2018,
Brodic D, Draganov IR
2017 3rd International Conference on Applied and Theoretical Computing and Communication Technology (iCATccT), Tumkur, India. IEEE: 322-327; ISBN 978-1-5386-1145-6
-
2018,
Dong F, Liu Z, Zhang J, Fang J, Guo J, Zhang J, Fang J, Zhang Y
2017 IEEE International Conference on Plasma Science (ICOPS), Atlantic City, NJ, USA. IEEE: 1; ISBN 978-1-5090-5244-8