Die folgenden Begriffe wurden einbezogen:
implant, Implantat, インプラント
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International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE),
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2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 257-260; ISBN 978-1-7281-7431-0
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2020,
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2020 XXXIIIrd General Assembly and Scientific Symposium of the International Union of Radio Science, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5690-3
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2020,
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2020,
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2020 XXXIIIrd General Assembly and Scientific Symposium of the International Union of Radio Science, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5690-3
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2020,
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2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Montreal, QC, Canada. IEEE: 6107-6110; ISBN 978-1-7281-1991-5
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2020,
Wang Y, Zheng J, Wang Q, Chen J
2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Montreal, QC, Canada. IEEE: 4200-4203; ISBN 978-1-7281-1991-5
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