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2014,
Lv B, Su C, Yang L, Xie Y, Wu T
2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Chicago, IL, USA. IEEE: S. 986-989; ISBN 978-1-4244-7929-0
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2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 190-193; ISBN 978-4-88552-287-1
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2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 186-189; ISBN 978-4-88552-287-1
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2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 166-169; ISBN 978-4-88552-287-1
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2014,
Chakarothai J, Suzuki Y, Taki M, Kojima M, Sasaki K, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 182-185; ISBN 978-4-88552-287-1
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2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 237-240; ISBN 978-4-88552-287-1
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2014,
Kim HS, Lee YH, Choi HD, Lee AK, Lee YS, Pack JK, Kim N, Ahn YH
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 170-173; ISBN 978-4-88552-287-1
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2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 832-835; ISBN 978-4-88552-287-1
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2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 430-433; ISBN 978-4-88552-287-1
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2014,
Kang WG, Alexander Z, Jun HY, Park YH, Pack JK
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 198-201; ISBN 978-4-88552-287-1