Die folgenden Begriffe wurden einbezogen:
electromagnetic, elektromagnetisch, 電磁気の
-
2019,
Nimpf S, Nordmann GC, Kagerbauer D, Malkemper EP, Landler L, Papadaki-Anastasopoulou A, Ushakova L, Wenninger-Weinzierl A, Novatchkova M, Vincent P, Lendl T, Colombini M, Mason MJ, Keays DA
Curr Biol 29 (23): 4052-4059.e4
-
2019,
Bodemann R, Finke J, von Freeden J, Gritsch T, Heinrich H, Hoffmann M, Jeschke P, Joosten S, Krischek R, Reidenbach HD, Schiessl K, Schreiber M, Schühle E, Storch D, Stunder D
Fachverband für Strahlenschutz e. V. (FS),
FS-2019-180-AKNIR: 1-111
-
2019,
Makarov S, Horner M, Noetscher G
Springer International Publishing, Cham (Schweiz); ISBN 978-3-030-21292-6
-
2019,
Rahayu Y, Hilmi MF, Masdar H
2019 16th International Conference on Quality in Research (QIR): International Symposium on Electrical and Computer Engineering, Padang, Indonesia. IEEE: 1-5; ISBN 978-1-7281-1899-4
-
2019,
Feng X, Chen X, Wang Y, Wang J
2019 8th International Symposium on Next Generation Electronics (ISNE), Zhengzhou, China. IEEE: 1-3; ISBN 978-1-7281-2063-8
-
2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 43-46; ISBN 978-1-7281-1639-6
-
2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
-
2019,
Zachepa N, Chorna O, Rieznik D
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: 158-161; ISBN 978-1-7281-2570-1
-
2019,
Mondal SP, Padmini TN
2019 International Conference on Vision Towards Emerging Trends in Communication and Networking (ViTECoN), Vellore, India. IEEE: 1-4; ISBN 978-1-5386-9354-4
-
2019,
Rieznik D, Zachepa I, Zachepa N, Sukach S, Chenchevoi V, Vovna O
2019 IEEE International Conference on Modern Electrical and Energy Systems (MEES), Kremenchuk, Ukraine. IEEE: 198-201; ISBN 978-1-7281-2570-1
-
2019,
Gao G, Zhang R, Yang C, Meng H, Geng W, Hu B
IET Microwaves, Antennas & Propagation 13 (13): 2319 - 2323
-
2019,
Lan Q, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: 1861-1862; ISBN 978-1-7281-0693-9
-
2019,
Phaneuf M, Mojabi P
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: 533-534; ISBN 978-1-7281-0693-9
-
2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 744-747; ISBN 978-1-7281-1639-6
-
2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 766-769; ISBN 978-1-7281-1639-6
-
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 166-169; ISBN 978-1-7281-1639-6
-
2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 750-753; ISBN 978-1-7281-1639-6
-
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 691-694; ISBN 978-1-7281-1639-6
-
2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 48-51; ISBN 978-1-7281-1639-6
-
2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 334-337; ISBN 978-1-7281-1639-6
-
Radiologe 59 (10): 885-893
-
Radiologe 59 (10): 894-897
-
2019,
Sistani S, Fatemi I, Shafeie SA, Kaeidi A, Azin M, Shamsizadeh A
Somatosens Mot Res 36 (4): 292-297
-
Brain Nerve 71 (11): 1129-1137
-
2019,
Tognola G, Chiaramello E, Bonato M, Magne I, Souques M, Fiocchi S, Parazzini M, Ravazzani P
Int J Environ Res Public Health 16 (22): E4363