Die folgenden Begriffe wurden einbezogen:
copper, Cu<sup>2+</sup>, Kupfer
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2019,
Raj AB, Nesasudha M
2019 2nd International Conference on Signal Processing and Communication (ICSPC), Coimbatore, India. IEEE: S. 193-197; ISBN 978-1-7281-1850-5
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2019,
Wagih M, Wei Y, Beeby S
IEEE Antennas Wirel Propag Lett 18 (1): 49-53
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2019,
Baltušnikaitė-Guzaitienė J, Varnaitė-Žuravliova S
Jaroszewski M, Thomas S, Rane AV (Hrsg.): Advanced Materials for Electromagnetic Shielding: Fundamentals, Properties, and Applications. John Wiley & Sons, Inc.; S. 219-239; ISBN 978-1-119-12861-8
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2019 4th International Conference on Electrical Information and Communication Technology (EICT), Khulna, Bangladesh. IEEE: S. 1-5; ISBN 978-1-7281-6041-2
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2019 International Conference on Robotics,Electrical and Signal Processing Techniques (ICREST), Dhaka, Bangladesh. IEEE: S. 253-257; ISBN 978-1-5386-8015-5
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2019,
Ahmad MS, Rahman MM, Morshed KM
2019 5th International Conference on Advances in Electrical Engineering (ICAEE), Dhaka, Bangladesh. IEEE: S. 617-622; ISBN 978-1-7281-4935-6
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2019,
Timilsina R, Qian C
IEEE Trans Biomed Circuits Syst 13 (2): 444-453
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2019,
Syrek P, Skowron M, Ciesla A
2019 11th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: S. 1-4; ISBN 978-1-7281-0102-6
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2019,
Balakrishnan SA, Sundarsingh EF
IET Microwaves, Antennas & Propagation 13 (14): 2480-2485
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2019,
Machts R, Hunold A, Drebenstedt C, Rock M, Leu C, Haueisen J
PLoS One 14 (9): e0223133
