Suchergebnisse

2823 Artikel wurden gefunden.

Die folgenden Begriffe wurden einbezogen: athermal, nichtthermisch, athermisch, non-thermal, 非熱の, 非熱的

• 2013, Ledoigt G, Belpomme D
  Cancer induction molecular pathways and HF-EMF irradiation [tech./dosim.]
  Adv Biol Chem 3 (2): 177-186
• 2013, Sinha RK, Singh SS, Aggarwal Y
  Chronic Exposure of Low Power Radio Frequency Changes the EEG Signals of Rats—Low Power Radio Frequency Alters EEG [med./bio.]
  Adv Biomed Eng Res 1 (2): 17-23
• 2013, Spelten O, Wetsch WA, Hinkelbein J
  [Details] Präklinische Versorgung einer lichtbogenbedingten schweren Verbrennung an einer Bahnoberleitung [Review]
  Unfallchirurg 116 (9): 847-853
• 2013, Chen HY, Lee HM
  EM absorption and temperature increase in human bodies due to EM fields emitted from on-body transceivers at 2.45 GHz [tech./dosim.]
  2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), Melbourne, VIC. IEEE: S. 1-4; ISBN 978-1-5090-1885-7
• 2013, Tanaka R
  Response to: Magnetic resonance imaging and thermal injury [Kommentar]
  J Neurosurg 119 (4): 1084-1085
• 2013, Friedstat JS, Moore ME, Goverman J, Fagan SP
  An unusual burn during routine magnetic resonance imaging [Grundlagen]
  J Burn Care Res 34 (2): e110-e111
• 2013, Carter EL, Newcombe VF, Hawkes RC, Coles JP
  Magnetic resonance imaging and thermal injury [Kommentar]
  J Neurosurg 119 (4): 1082-1084
• 2013, Demidova EV, Goryachkovskaya TN, Malup TK, Bannikova SV, Semenov AI, Vinokurov NA, Kolchanov NA, Popik VM, Peltek SE
  Studying the non-thermal effects of terahertz radiation on E. coli/pKatG-GFP biosensor cells [med./bio.]
  Bioelectromagnetics 34 (1): 15-21
• 2013, Leitgeb N
  The Impact of Thermal Modeling on Limiting RF-EMF [tech./dosim.]
  J Electromagn Anal 5 (4): 137-144
• 2013, Bt Lias K, Buniyamin N, Ahmad Narihan MZB
  [Details] An overview of cancer thermal therapy technology based on different types of antenna exposure [Review]
  2013 International Conference on Electrical, Electronics and System Engineering (ICEESE), Kuala Lumpur. IEEE: S. 96-101; ISBN 978-1-4799-3177-4