Die folgenden Begriffe wurden einbezogen:
Radio, Rundfunk, broadcast, 放送
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2019,
Makarov S, Horner M, Noetscher G
Springer International Publishing, Cham (Schweiz); ISBN 978-3-030-21292-6
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2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 43-46; ISBN 978-1-7281-1639-6
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2019,
Ji X, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 527-528; ISBN 978-1-7281-0693-9
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2019,
Le DT, Li K, Watanabe S, Onishi T
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 523-524; ISBN 978-1-7281-0693-9
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2019,
Mao C, Werner PL, Werner DH, Vital D, Bhardwaj S
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 1555-1556; ISBN 978-1-7281-0693-9
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2019,
Ebadi-Shahrivar A, Fay P, Hochwald BM, Love DJ
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 1005-1006; ISBN 978-1-7281-0693-9
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2019,
Lan Q, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 1861-1862; ISBN 978-1-7281-0693-9
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2019,
Phaneuf M, Mojabi P
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 533-534; ISBN 978-1-7281-0693-9
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2019,
Song S, Zheng J, Chen J
2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, Atlanta, GA, USA. IEEE: S. 1009-1010; ISBN 978-1-7281-0693-9
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 744-747; ISBN 978-1-7281-1639-6