Die folgenden Begriffe wurden einbezogen:
Magnetfeld, MF, "magnetic field", 磁界
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2023,
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2023,
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2023,
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2023,
Bundesanstalt für Arbeitsschutz und Arbeitsmedizin (BAuA)
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2023,
Bundesanstalt für Arbeitsschutz und Arbeitsmedizin (BAuA)
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2023,
Bundesanstalt für Arbeitsschutz und Arbeitsmedizin (BAuA)
GMBl [Nr. 3–12]: 50
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J Ambient Intell Humaniz Comput 14 (5): 5977-5993
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2023,
Conde-Antón Á, Hernando-Garijo I, Jiménez-Del-Barrio S, Mingo-Gómez MT, Medrano-de-la-Fuente R, Ceballos-Laita L
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2022,
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2022,
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2022,
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2022 International Conference on Electronics and Renewable Systems (ICEARS), Tuticorin, India. IEEE: 1865-1868; ISBN 978-1-6654-8426-8
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2022,
Yang H, Liu X, Fan Y
IEEE Trans Antennas Propag 70 (1): 209-220
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2022,
Visser HJ, Huismans E, Song M, Liu YH
2021 51st European Microwave Conference (EuMC), London, United Kingdom. IEEE: 1038-1041; ISBN 978-1-6654-4721-8
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2022 International Conference on Knowledge Engineering and Communication Systems (ICKES), Chickballapur, India. IEEE: 1-6; ISBN 978-1-6654-5638-8
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2022,
Ali SA, Wajid M, Kumar A, Shah Alam M
IEEE Access 10: 88567-88594
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2022,
Mukesh AN, Sharma PK, Yadav VP, Payal PO, Solanki L
2022 International Conference on Electronics and Renewable Systems (ICEARS), Tuticorin, India. IEEE: 1861-1864; ISBN 978-1-6654-8426-8
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2022,
Kim HS, Song BP, Kim R, Choi WC, Kim D, Shim WM, Kim KN, Lee SK
IEEE Access 10: 42097-42107
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2022,
Caramazza L, Paffi A, Liberti M, Apollonio F
2021 51st European Microwave Conference (EuMC), London, United Kingdom. IEEE: 785-788; ISBN 978-1-6654-4721-8
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2022,
Alshhawy S, Barakat A, Yoshitomi K, Pokharel RK
IEEE Transactions on Circuits and Systems II: Express Briefs 69 (3): 869-873
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2022,
Sharma KK, Bindle A, Reshma
2022 International Conference on Computing, Communication and Power Technology (IC3P), Visakhapatnam, India. IEEE: 172-175; ISBN 978-1-6654-2526-1
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2022 International Conference on Applied Physics and Computing (ICAPC), Ottawa, ON, Canada. IEEE: 104-106; ISBN 978-1-6654-6304-1
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2022,
Mittal V, Yaduvanshi RS
2022 2nd Asian Conference on Innovation in Technology (ASIANCON), Ravet, India. IEEE: 1-4; ISBN 978-1-6654-6852-7
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2022,
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IEEE Trans Microw Theory Tech 70 (11): 4706-4710
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2022,
Gasperini D, Costa F, Daniel L, Manara G, Genovesi S
2022 Sixteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials), Siena, Italy. IEEE: X-151-X-153; ISBN 978-1-6654-6585-4