Die folgenden Begriffe wurden einbezogen:
Kupfer, Cu<sup>2+</sup>, copper
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2024,
Jarin M, Wang T, Xie X
Nat Commun 15: 1345
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2024,
Zhang K, Soh PJ, Chen J, Yan S
IEEE J Electromagn RF Microw Med Biol 8 (1): 68-77
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Radiat Prot Dosimetry 200 (2): 187–200
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2024,
Baudh RK, Sahu S, Singh Parihar M, Kumar V D
IEEE Transactions on Circuits and Systems II: Express Briefs 71 (2): 567-571
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2023,
Abiramasundari V, Thyla B, Jose Anand A
2023 Seventh International Conference on Image Information Processing (ICIIP), Solan, India. IEEE: S. 446-449; ISBN 9798350371413
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2023,
Clara CC, Sweetlin SR, Ashick JS, Nesasudha M
2023 International Conference on Innovative Data Communication Technologies and Application (ICIDCA), Uttarakhand, India. IEEE: S. 1021-1028; ISBN 9798350397215
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2023,
Jahan I, Noman MOF, Tasnim MES, Kabir MA
2023 5th International Conference on Sustainable Technologies for Industry 5.0 (STI), Dhaka, Bangladesh. IEEE: S. 1-6; ISBN 9798350394320
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2023,
Sawant VG, Kadam P, Mangrulkar V, Gawade H, Patil Y
2023 6th International Conference on Advances in Science and Technology (ICAST), Mumbai, India. IEEE: S. 638-642; ISBN 9798350359824
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2023,
Ahmed MS, Ibrahim Z, Islam MM, Shahadat Islam Sumon M, Ehtesanul Islam AKM
2023 26th International Conference on Computer and Information Technology (ICCIT), Cox's Bazar, Bangladesh. IEEE: S. 1-6; ISBN 9798350359022
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2023,
Vignesh SJ, Natarajamani S
2023 International Conference on Microwave, Optical, and Communication Engineering (ICMOCE), Bhubaneswar, India. IEEE: S. 1-4; ISBN 9798350321616