Die folgenden Begriffe wurden einbezogen:
Inkorporierung, Inkorporation, incorporation, 取り込み
-
2020,
Fleming JE, Dunn E, Lowery MM
Front Neurosci 14: 166
-
2020 International Conference on COMmunication Systems & NETworkS (COMSNETS), Bengaluru, India. IEEE: S. 559-562; ISBN 978-1-7281-3188-7
-
Food and Drug Administration (FDA),
Review: 1-112
-
2020,
Kronberg G, Rahman A, Sharma M, Bikson M, Parra LC
Brain Stimul 13 (2): 287-301
-
2019,
Wagih M, Wei Y, Beeby S
IEEE Antennas Wirel Propag Lett 18 (1): 49-53
-
2019,
Scientific Advisory Committee on Radio Frequencies and Health (CCARS)
1-15
-
2019,
Crosson B, Rodriguez AD, Copland D, Fridriksson J, Krishnamurthy LC, Meinzer M, Raymer AM, Krishnamurthy V, Leff AP
J Neurol Neurosurg Psychiatry 90 (10): 1147-1155
-
2019,
Sang M, Wang S, Liu S, Liu M, Bai L, Jiang W, Xuan S, Gong X
ACS Appl Mater Interfaces 11 (50): 47340-47349
-
2019,
Mescia L, Chiapperino MA, Bia P, Lamacchia CM, Gielis J, Caratelli D
2019 PhotonIcs & Electromagnetics Research Symposium - Spring (PIERS-Spring), Rome, Italy. IEEE: S. 2985-2991; ISBN 978-1-7281-3404-8
-
2019,
Thomas C, Huang Y, Faria PC, Datta A
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: S. 6442-6445; ISBN 978-1-5386-1312-2
-
2019,
Orru G, Baroni M, Cesari V, Conversano C, Hitchcott PK, Gemignani A
Arch Ital Biol 157 (2-3): 89-101
-
2019,
Shoaib N, Zaidi SNF, Shafqat A, Cheema HM
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Hangzhou, China. IEEE: S. 210-212; ISBN 978-1-7281-4263-0
-
2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: S. 162-165; ISBN 978-1-7281-1639-6
-
Radiologe 59 (10): 894-897
-
Am J Psychiatry 176 (11): 904-910
-
2019,
Gomez-Tames J, Tarnaud T, Miwa K, Hirata A, Van de Steene T, Martens L, Tanghe E, Joseph W
IEEE Trans Electromagn Compat 61 (6): 1944 - 1952
-
2019,
Thomas AA, Rauschkolb PK
Curr Opin Neurol 32 (6): 857-863
-
Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std C95.1-2019: 1-312, ISBN 978-1-5044-5548-0
-
2019,
Li N, Friedrich R, Maesano CN, Medda E, Brescianini S, Stazi MA, Sabel CE, Sarigiannis D, Annesi-Maesano I
Environ Res 179 Pt A: 108744
-
2019,
Filippi M, Dasen B, Guerrero J, Garello F, Isu G, Born G, Ehrbar M, Martin I, Scherberich A
Biomaterials 223: 119468
-
2019,
Al Abed A, Pinyon JL, Foster E, Crous F, Cowin GJ, Housley GD, Lovell NH
Front Neurosci 13: 691
-
2019,
Bikson M, Esmaeilpour Z, Adair D, Kronberg G, Tyler WJ, Antal A, Datta A, Sabel BA, Nitsche MA, Loo C, Edwards D, Ekhtiari H, Knotkova H, Woods AJ, Hampstead BM, Badran BW, Peterchev AV
Brain Stimul 12 (6): 1349-1366
-
2019,
Miyamoto H, Sawaji Y, Iwaki T, Masaoka T, Fukada E, Date M, Yamamoto K
Bioelectromagnetics 40 (6): 412-421
-
2019,
Hershkovich HS, Urman N, Yesharim O, Naveh A, Bomzon Z
Phys Med Biol 64 (18): 185014
-
2019,
Krogh CM, Harrington MEB
Altern Ther Health Med 25 (3): 32-38
