Die folgenden Begriffe wurden einbezogen:
Induktion, induktives, induction, 誘導
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2020,
Dergham I, Martinez Rocha JC, Imad R, Alayli Y
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-5; ISBN 978-1-7281-5580-7
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-4; ISBN 978-1-7281-5580-7
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2020,
Simonazzi M, Sandrolini L, Reggiani U
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-5; ISBN 978-1-7281-5580-7
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2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: S. 1-4; ISBN 978-1-7281-5580-7
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2020,
Lämmle T, Parspour N, Mönch M
2020 5th International Conference on Smart and Sustainable Technologies (SpliTech), Split, Croatia. IEEE: S. 1-6; ISBN 978-1-7281-7363-4
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2020,
Borzoueisileh S, Shabestani Monfared A, Ghorbani H, Mortazavi SMJ, Zabihi E, Pouramir M, Shafiee M, Niksirat F
Res Rep Urol 12: 527-532
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Somatosens Mot Res 37 (4): 300-306
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2020,
Tachizaki T, Sakaguchi R, Terada S, Kamei KI, Hirori H
Opt Lett 45 (21): 6078-6081
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2020,
Matsubara K, Wada K, Suzuki Y
2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI, USA. IEEE: S. 451-455; ISBN 978-1-7281-5827-3
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2020,
Mohammad M, Pries JL, Onar OC, Galigekere VP, Su GL
2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI, USA. IEEE: S. 842-849; ISBN 978-1-7281-5827-3
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2020,
Zhang B, Carlson RB, Galigekere VP, Onar OC, Pries JL
2020 IEEE Energy Conversion Congress and Exposition (ECCE), Detroit, MI, USA. IEEE: S. 5185-5192; ISBN 978-1-7281-5827-3
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2020,
Vincenzi F, Pasquini S, Setti S, Salati S, Cadossi R, Borea PA, Varani K
Int J Mol Sci 21 (21): E8053
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International Electrotechnical Commission (IEC), Institute of Electrical and Electronics Engineers (IEEE),
IEC/IEEE 62209-1528:2020: 1-284, ISBN 978-2-8-3228533-6
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2020,
Cywiak C, Ashbaugh RC, Metto AC, Udpa L, Qian C, Gilad AA, Reimers M, Zhong M, Pelled G
Brain Stimul 13 (6): 1774-1783
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2020,
Xia M, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 257-260; ISBN 978-1-7281-7431-0
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2020,
Andrenko AS, Chakarothai J, Wake K, Onishi T
2020 XXXIIIrd General Assembly and Scientific Symposium of the International Union of Radio Science, Rome, Italy. IEEE: S. 1-2; ISBN 978-1-7281-5690-3
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2020,
Koponen LM, Stenroos M, Nieminen JO, Jokivarsi K, Gröhn O, Ilmoniemi RJ
Sci Rep 10: 17397
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2020,
Nguyen H, Ledent M, Beauvois V, Anthonissen R, Verschaeve L, Collard JF, Hinsenkamp M, Feipel V, Mertens B
MethodsX 7: 101071
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2020,
Ye E, Lee S, Park W, Park E, Cho DW, Jang J, Park SM
IEEE Access 8: 194363-194372
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2020,
Voloshin T, Schneiderman RS, Volodin A, Shamir RR, Kaynan N, Zeevi E, Koren L, Klein-Goldberg A, Paz R, Giladi M, Bomzon Z, Weinberg U, Palti Y
Cancers 12 (10): E3016
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2020,
Ouadah NS, Blazy K, Villégier AS
Int J Environ Res Public Health 17 (20): E7563
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2020,
Begemann MJ, Brand BA, Ćurčić-Blake B, Aleman A, Sommer IE
Psychol Med 50 (15): 2465-2486
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2020,
Perucca Orfei C, Lovati AB, Lugano G, Viganò M, Bottagisio M, D'Arrigo D, Sansone V, Setti S, de Girolamo L
Bone Joint Res 9 (9): 613-622
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2020,
Qiu S, Wang S, Yi W, Zhang C, He H
2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Montreal, QC, Canada. IEEE: S. 3549-3552; ISBN 978-1-7281-1991-5
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2020,
Wang Y, Zheng J, Wang Q, Chen J
2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Montreal, QC, Canada. IEEE: S. 4200-4203; ISBN 978-1-7281-1991-5