Die folgenden Begriffe wurden einbezogen:
Hochspannung, "high voltage", 高電圧
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2023,
Dong L, Chen Y, Wang K, Li H, Di G
Int Immunopharmacol 125 Pt A: 111006
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2023,
Li Q, Ba T, Cao SJ, Chen Q, Zhou B, Yan ZQ, Hou ZH, Wang LF
Chin J Burns Wounds 39 (8): 738-745
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2023,
Hou T, Wang Z, Zhao M, Liu C, Xin M, Wu L, Zhang B
INMATEH - Agric Eng 70 (2): 517-526
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2023,
Varshney A, Semwal A, Chandra Yadav A, Mahto K, Sangwan D, Bhattarai S, Tyagi AK
Cureus 15 (9): e45443
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2023,
Gilles F, Nicot F, Boyer C, Georges JL
BMJ Case Rep 16 (10): e257010
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2023,
Qu H, Wang Y, Wang B, Li C
BMC Microbiol 23 (1): 290
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2023,
Nazemi M, Dommerque R, Daniel S
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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Chin J Burns Wounds 39 (8): 718-723
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2023,
Kursawe M, Kaifie A, Krabbe J, Kimpeler S, Kühn R, Kraus T, Jankowiak K
Sci Rep 13: 16320
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2023,
Morosanu V, Balasa R, Morosanu S, Baróti B, Roman-Filip I
Cureus 15 (8): e43951
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Acta Chir Plast 65 (2): 66-69
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2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 413-418; ISBN 9798350309775
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2023,
Huber P, Mohanty P, Jenau F
2023 IEEE Electrical Insulation Conference (EIC), Quebec City, QC, Canada. IEEE: 1-4; ISBN 978-1-6654-9342-0
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2023,
Hasselman DJ, Hemery LG, Copping AE, Fulton EA, Fox J, Gill AB, Polagye B
Sci Total Environ 904: 166801
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2023,
Chavan PK, Autade SB, Pardeshi DB, William P
2023 5th International Conference on Inventive Research in Computing Applications (ICIRCA), Coimbatore, India. IEEE: 1714-1718; ISBN 9798350321432
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2023,
Samia AM, Thanikachalam S, Dermer H, Maddy AJ
Skinmed 21 (3): 157-163
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2023,
Hansson Mild K, Mattsson MO, Jeschke P, Israel M, Ivanova M, Shalamanova T
Int J Environ Res Public Health 20 (16): 6552
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Actual Jurid Ambient (134): 4-34
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2023,
Turuban M, Kromhout H, Vila J, Vallbona-Vistós M, Baldi I, Turner MC
Environ Int 180: 108156
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2023,
Nguyen A, Crespi CM, Vergara X, Kheifets L
Environ Res 238 Pt 1: 116899
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2023,
Dharanindra M, Pothineni RB, Gontla DK, P SR, Shriram Dhanasekaran K
Cureus 15 (7): e41940
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2023,
Hirota R, Teramoto A, Chiba M, Onuma M, Narimatsu H, Yotsuyanagi T, Yamashita T
Spine Surg Relat Res 7 (4): 410-413
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2023,
Zhang H, Qin B, Zhao Y, Zhang R, Zhang G
Int Wound J 20 (7): 2649-2656
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2023,
Dündar AS, Altın İ, Aksöz C, Sarın AB, Özdemir B
J Forensic Sci 68 (6): 2076-2084
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2023,
Ramirez-Bettoni E, Nemeth B
IEEE Trans Ind Appl 59 (4): 5169-5177