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2023,
Xu LJ, Zhu XW, Liang M, Huang M
2023 IEEE Biomedical Circuits and Systems Conference (BioCAS), Toronto, ON, Canada. IEEE: S. 1-4; ISBN 9798350300277
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2023,
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Electromagn Biol Med 42 (4): 163-181
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2023,
Lestini F, Marrocco G, Occhiuzzi C
2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa, Italy. IEEE: S. 445-448; ISBN 9798350323054
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Yang HN, Liang Y, Han DW, Liu L, Xie JF, Tian SM, Xia CD, Wei Y
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2023 4th IEEE Global Conference for Advancement in Technology (GCAT), Bangalore, India. IEEE: S. 1-6; ISBN 9798350305265
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Ma Y, Huang Q, Ji X, Bai J
2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Sydney, Australia. IEEE: S. 1-4; ISBN 9798350324488
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Schieve B, Belovs L, Potter B, Lannan FM
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Tian R, Wu YQ, Lu M, Miao XF
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2023,
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2023 IEEE SENSORS, Vienna, Austria. IEEE: S. 1-4; ISBN 9798350303889
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2023,
Lai J, Wang Z, Zhou H, Li P, Lu H, Tu T
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2023,
Sharaf MH, Arrebola M, Hussein KFA, Farahat AE
2023 3rd International Conference on Electronic Engineering (ICEEM), Menouf, Egypt. IEEE: S. 1-4; ISBN 9798350323528
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2023,
Hajiaghajani A, Rwei P, Afandizadeh Zargari AH, Escobar AR, Kurdahi F, Khine M, Tseng P
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2023,
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2023 IEEE MTT-S International Microwave Biomedical Conference (IMBioC), Leuven, Belgium. IEEE: S. 82-84; ISBN 978-1-6654-9218-8
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2023,
Alsing KK, Olsen O, Koch CB, Hansen RH, Persson DP, Qvortrup K, Serup J
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2023,
Miron JP, Couture M, Desbeaumes Jodoin V, Bousseau E, Massé-Leblanc C, Bolduc C, Blumberger DM, Datta A, Nitsche MA, Lespérance P
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2023,
Smith LA, Bem JD, Lv X, Lauto A, Sliow A, Ma Z, Mahns DA, Berryman C, Hutchinson MR, Fumeaux C, Tettamanzi GC
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2023,
Oh SJ, Maeng I, Son HY, Lee ES, Lee IM, Park KH
2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Montreal, QC, Canada. IEEE: S. 1-2; ISBN 9798350336610
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2023,
Mancuso M, Cruciani A, Sveva V, Casula EP, Brown K, Rothwell JC, Di Lazzaro V, Koch G, Rocchi L
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2023,
Ma Y, Wang N, Li K, Liang H, Bai J, Ji X
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2023,
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2023 IEEE USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), Portland, OR, USA. IEEE: S. 49-50; ISBN 978-1-6654-6826-8
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2023,
Govindan T, Palaniswamy SK, Kanagasabai M, Kumar S, Agarwal R, Kumar R, Panigrahy D
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