-
2022,
Tan B, Canturk Tan F, Yalcin B, Dasdag S, Yegin K, Yay AH
J Chem Neuroanat 126: 102187
-
2022,
Tayebi-khorami M, Chegeni N, Tahmasbi Birgani M, Danyaei A, Fardid R, Zafari J
Pharm Sci 28 (2): 295-303
-
Vet Sci 9 (11): 613
-
2022,
Lee Y, Oh BM, Park SH, Han TR
Ann Rehabil Med 46 (5): 228-236
-
2022,
Veerana M, Yu NN, Bae SJ, Kim I, Kim ES, Ketya W, Lee HY, Kim NY, Park G
J Fungi 8 (11): 1187
-
2022,
Olejárová S, Moravčík R, Herichová I
Int J Mol Sci 23 (21): 13210
-
2022,
Zablodskiy M, Pliuhin V, Kucheruk P
2022 IEEE 41st International Conference on Electronics and Nanotechnology (ELNANO), Kyiv, Ukraine. IEEE: S. 391-396; ISBN 978-1-6654-6923-4
-
2022,
Hoang TT, Whitcomb E, Reardon EE, Spector LG, Lupo PJ, Scheurer ME, Williams LA
Curr Epidemiol Rep 9 (4): 338–360
-
2022,
SSM’s Scientific Council on Electromagnetic Fields
Swedish Radiation Safety Authority (SSM),
Report number: 2022:16: 1-100
-
2022,
Chae MS, Lee N, Koh HJ
Medicina 58 (10): 1407
-
2022,
Borzoueisileh S, Shabestani Monfared A, Mortazavi SMJ, Zabihi E, Pouramir M, Niksirat F, Seyfizadeh N, Shafiee M
J Biomed Phys Eng 12 (5): 505-512
-
2022,
Sarkar A, Dipani A, Leodori G, Popa T, Kassavetis P, Hallett M, Thirugnanasambandam N
Brain Sci 12 (10): 1401
-
2022,
González-García Y, Meza-Contreras JC, Gutiérrez-Ortega JA, Manríquez-González R
Polymers 14 (20): 4388
-
2022,
Ronniger M, Aguida B, Stacke C, Chen Y, Ehnert S, Erdmann N, Eschenburg G, Falldorf K, Pooam M, Wing A, Ahmad M
Bioengineering 9 (10): 595
-
2022,
Šušnjara A, Poljak D, Matić I
2022 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: S. 1-5; ISBN 978-1-6654-7018-6
-
2022,
Sahm F, Freiin Grote V, Zimmermann J, Haack F, Uhrmacher AM, van Rienen U, Bader R, Detsch R, Jonitz-Heincke A
Front Physiol 13: 965181
-
2022,
Caparelli EC, Abulseoud OA, Gu H, Zhai T, Schleyer B, Yang Y
Front Neurosci 16: 997259
-
2022,
International Commission on the Biological Effects of Electromagnetic Fields (ICBE-EMF)
Environ Health 21: 92
-
2022,
Yamaguchi-Sekino S, Iwakiri K, Sekino M, Nakai T
IEEJ Trans Electr Electron Eng 17 (7): 981-985
-
2022,
Jorge DMF, Huber SC, Rodrigues BL, Da Fonseca LF, Azzini GOM, Parada CA, Paulus-Romero C, Lana JFSD
Int J Mol Sci 23 (19): 11726
-
2022,
Toffanin T, Folesani F, Ferrara M, Belvederi Murri M, Zerbinati L, Caruso R, Nanni MG, Koch G, Fadiga L, Palagini L, Perini G, Benatti B, Dell'Osso B, Grassi L
Gen Hosp Psychiatry 79: 19-32
-
2022,
Kitajima T, Schüz J, Morita A, Ikeda W, Tanaka H, Togawa K, Gabazza EC, Taki M, Toriyabe K, Ikeda T, Sokejima S
Int J Environ Res Public Health 19 (19): 11912
-
2022,
Sannino A, Scarfi MR, Romeo S, Priault M, Dufossee M, Poeta L, Prouzet-Mauleon V, Zeni O
2022 Microwave Mediterranean Symposium (MMS), Pizzo Calabro, Italy. IEEE: S. 1-5; ISBN 978-1-6654-7111-4
-
2022,
Han F, Yin S, Wu H, Zhou C, Wang X
J Mech Med Biol 22 (8): 2240026
-
2022,
Guerra-Hühne J, Bola S, Calzia D, Alexopoulou D, Funk RHW, Mühlen SS, Roehlecke C
Front Biosci (Landmark Ed) 27 (9): 273
-
2022,
Wu R, Ou X, Zhang L, Song X, Wang Z, Dong M, Liu L
Langmuir 38 (40): 12346-12355
-
2022,
Chen R, Shuai J, Xie Y, Wang B, Hu X, Guo W, Lyu W, Zhou D, Mosa A, Wang H
Chemosphere 309 Pt 1: 136762
-
2022,
Barmore W, Patel H, Voong C, Tarallo C, Calkins Jr JB
World J Cardiol 14 (8): 446-453
-
2022,
Al-Khlaiwi T, Habib SS, Alshalan M, Al-Qhatani M, Alsowiegh S, Queid S, Alyabis O, Al-Khliwi H
Heliyon 8 (9): e10646
-
2022,
Zhu K, Guo L, Patel P, Albeck J, Qing Q, Losert W, Zhao M
STAR Protoc 3 (4): 101752
-
2022,
Li Y, Jiang X, Zhang Z, Liu J, Wu C, Chen Y, Zhou J, Zhang J, Zhang X
Free Radic Biol Med 192: 213-223
-
2022,
Prosvetov AO, Tsygankov BD, Guekht AB, Kuznetsov EV, Less UE, Tumurov DA, Popov GR, Tsygankov DB, Rangus SR
Zh Nevrol Psikhiatr Im S S Korsakova 122 (9): 79-85
-
2022,
Lennikov A, Yang M, Chang K, Pan L, Saddala MS, Lee C, Ashok A, Cho KS, Utheim TP, Chen DF
Front Cell Dev Biol 10: 980775
-
2022,
Barbosa Filho JML, Campos MMdM, Flor DL, Alves WS, D’Assunção AG, Rodrigues MEC, de Sousa VAJr
Sensors 22 (18): 7017
-
Electromagn Biol Med 41 (4): 429-438
-
2022,
Parmagnani AS, D'Alessandro S, Maffei ME
Plant Sci 325: 111483
-
2022,
Chen MY, Li J, Zhang N, Waldorff EI, Ryaby JT, Fedor P, Jia Y, Wang Y
Technol Cancer Res Treat 21: 15330338221124658
-
2022,
Gayduk AJ, Shishkovskaia TI, Cumming P, Koutsomitros T, Sack AT, Vlasov YV, Smirnova D
Psychiatr Danub 34 Suppl 8: 105-111
-
2022,
Atiyea QM, Alsugmiany RZ, Al-najar FM, Hamad AM
J Pharm Negat Results 13 (Special Issue 1): 147-154
-
2022,
Chiaraviglio L, Lodovisi C, Franci D, Pavoncello S, Aureli T
2022 IEEE International Symposium on Measurements & Networking (M&N), Padua, Italy. IEEE: S. 1-6; ISBN 978-1-6654-8363-6
-
2022,
Lawler NB, Evans CW, Romanenko S, Chaudhari N, Fear M, Wood F, Smith NM, Iyer KS, Wallace VP
2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz), Delft, Netherlands. IEEE: S. 1-2; ISBN 978-1-7281-9428-8
-
2022,
Song M, Dong S, Zhang X, Dai Y, Zhang X, Shen Y
Sci Rep 12: 16108
-
2022,
Mai W, Fan YS, Miao FR
Zhen Ci Yan Jiu 47 (9): 801-808
-
2022,
Betta G, Capriglione D, Cerro G, Miele G, Migliore MD, Šuka D
2022 IEEE International Symposium on Measurements & Networking (M&N), Padua, Italy. IEEE: S. 1-6; ISBN 978-1-6654-8363-6
-
2022,
Adda S, Aureli T, Cassano T, Franci D, Migliore MD, Pasquino N, Pavoncello S, Schettino F, Schirone M
2022 IEEE International Symposium on Measurements & Networking (M&N), Padua, Italy. IEEE: S. 1-6; ISBN 978-1-6654-8363-6
-
2022,
Djuric N, Kljajic D, Gavrilov T, Markovic Golubovic N, Djuric S
2022 IEEE International Symposium on Measurements & Networking (M&N), Padua, Italy. IEEE: S. 1-6; ISBN 978-1-6654-8363-6
-
2022,
Saletnik B, Saletnik A, Słysz E, Zaguła G, Bajcar M, Puchalska-Sarna A, Puchalski C
Molecules 27 (18): 5823
-
2022,
He L, Yao Y, Wang N, Nan G
Sci Rep 12: 15839
-
2022,
Li Y, Sun C, Zhou H, Huang H, Chen Y, Duan X, Huang S, Li J
Animals 12 (18): 2420
-
2022,
Li J, Changyuan W, Yujie Z
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: S. 261-263; ISBN 978-1-6654-1672-6