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2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 237-240; ISBN 978-4-88552-287-1
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2014,
Choi DG, Kim KH, Jang JD, Chung SY, Gimm YM
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 638-641; ISBN 978-4-88552-287-1
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2014,
Kim HS, Lee YH, Choi HD, Lee AK, Lee YS, Pack JK, Kim N, Ahn YH
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 170-173; ISBN 978-4-88552-287-1
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2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 832-835; ISBN 978-4-88552-287-1
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2014,
Neufeld E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 230-233; ISBN 978-4-88552-287-1
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2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 430-433; ISBN 978-4-88552-287-1
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2014,
Kang WG, Alexander Z, Jun HY, Park YH, Pack JK
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 198-201; ISBN 978-4-88552-287-1
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2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 194-197; ISBN 978-4-88552-287-1
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2014,
Iwamoto T, Arima T, Uno T, Iwamoto T, Wake K, Fujii K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 529-532; ISBN 978-4-88552-287-1
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2014,
Shimizu HO, Shimizu K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Japan. IEEE: S. 162-165; ISBN 978-4-88552-287-1