Die folgenden Begriffe wurden einbezogen:
Ausplattierung, plating, 平板培養
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2019,
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2018,
Cui H, Zhong W, Li H, He F, Chen M, Xu D
2018 IEEE Applied Power Electronics Conference and Exposition (APEC), San Antonio, TX, USA. IEEE: S. 1336-1343; ISBN 978-1-5386-1181-4
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2018,
Al-Saadi M, Al-Qaisi M, Al-Bahrani L, Al-Omari A, Craciunescu A
2018 International Symposium on Fundamentals of Electrical Engineering (ISFEE), Bucharest, Romania. IEEE: S. 1-6; ISBN 978-1-5386-7213-6
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J Fac Agr Kyushu Univ 63 (2): 223-229
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2018 EMF-Med 1st World Conference on Biomedical Applications of Electromagnetic Fields (EMF-Med), Split, Croatia. IEEE: S. 1-2; ISBN 978-1-5386-5922-9
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2018,
Friesen AP, Conner RL, Robinson DE, Barton WR, Chatterton S, Gillard CL
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2018,
Shkliarskyi V, Matiieshyn Y, Grytsay V, Smarkutskyi T, Shckorbatov Y
2018 14th International Conference on Advanced Trends in Radioelecrtronics, Telecommunications and Computer Engineering (TCSET), Lviv-Slavske, Ukraine. IEEE: S. 728-731; ISBN 978-1-5386-2557-6
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2018,
Mohammad M, Haque MS, Choi S
2018 IEEE Energy Conversion Congress and Exposition (ECCE), Portland, OR, USA. IEEE: S. 97-104; ISBN 978-1-4799-7313-2
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2018,
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IEEE Trans Biomed Eng 65 (10): 2190-2201
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2018,
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2018,
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