Die folgenden Begriffe wurden einbezogen:
Ausplattierung, plating, 平板培養
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2022,
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2022,
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2022,
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2022,
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2022,
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2022,
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2022,
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J Neural Eng 19 (2): 026003
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2022,
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2022,
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2022,
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2022,
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2022,
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2022,
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2021,
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2021 6th International Conference on Signal Processing, Computing and Control (ISPCC), Solan, India. IEEE: S. 708-714; ISBN 978-1-6654-2555-1
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2021 29th Telecommunications Forum (TELFOR), Belgrade, Serbia. IEEE: S. 1-4; ISBN 978-1-6654-2586-5
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2021,
Adam C, Barth T, Münch M, Seide K, Krautschneider WH
2021 IEEE Biomedical Circuits and Systems Conference (BioCAS), Berlin, Germany. IEEE: S. 01-06; ISBN 978-1-7281-7205-7
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2021,
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2021,
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2021 12th International Symposium on Advanced Topics in Electrical Engineering (ATEE), Bucharest, Romania. IEEE: S. 1-6; ISBN 978-1-6654-4807-9
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2021,
Talluri G, Bindi M, Luchetta A, Grasso F, Luchetti L, Paolucci L
2021 IEEE 15th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG), Florence, Italy. IEEE: S. 1-6; ISBN 978-1-7281-8072-4
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2021,
Kroll MW, Hisey DAS, Andrews CJ, Perkins PE, Panescu D
2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), Mexico. IEEE: S. 1462-1467; ISBN 978-1-7281-1179-7
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2021,
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2021,
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2021,
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2021,
Chen L, Ye A, Liu X, Lu J, Xie Q, Guo Y, Sun W
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