Die folgenden Begriffe wurden einbezogen:
電磁界強度, Feldstärke, "field intensity", "field strength"
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2018,
Stam R, Yamaguchi-Sekino S
Ind Health 56 (2): 96-105
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2018,
Zhang K, Du L, Zhu Z, Song B, Xu D
IEEE Trans Electromagn Compat 60 (4): 829 - 839
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2018,
Khoshroo MM, Mehrjan MS, Samiee F, Soltani M, Shekarabi SPH
Fish Physiol Biochem 44 (1): 235-243
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2018,
Chakarothai J, Wake K, Arima T, Watanabe S, Uno T
IEEE Trans Microw Theory Tech 66 (3): 1543 - 1552
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2018,
Gomez-Tames J, Laakso I, Haba Y, Hirata A, Poljak D, Yamazaki K
IEEE Trans Electromagn Compat 60 (3): 589 - 597
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2018,
Soueid M, Dobbelaar MCF, Bentouati S, Bardet SM, O'Connor RP, Bessières D, Paillol J, Leveque P, Arnaud-Cormos D
Med Biol Eng Comput 56 (1): 85-97
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2018,
Cansiz M, Abbasov T, Kurt MB, Celik AR
J Expo Sci Environ Epidemiol 28 (2): 161-165
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2017,
Karpowicz J, Miclaus S, Gryz K
2017 E-Health and Bioengineering Conference (EHB), Sinaia, Romania. IEEE: S. 607-610; ISBN 978-1-5386-1514-0
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2017,
Sudsiri CJ, Jumpa N, Kongchana P, Ritchie RJ
Sci Hortic 220: 66-77
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2017,
Brysiewicz A, Formicki K, Tanski A, Wesolowski P
Eur Zool J 84 (1): 49-60
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2017,
Futatsumori S, Hikage T
2017 International Symposium on Antennas and Propagation (ISAP), Phuket, Thailand. IEEE: S. 1-2; ISBN 978-1-5386-0466-3
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Pol J Med Phys Eng 23 (4): 89-92
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Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
DIN EN 50527-2-1 VDE 0848-527-2-1:2017-12
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International Electrotechnical Commission (IEC),
IEC 62232:2017: 1-516, ISBN 978-2-8-3226302-0
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International Telecommunication Union (ITU),
ITU-T Recommendations K-Series, K.113 (2015) Err. 1 (10/2017)
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2017,
Stankovic V, Jovanovic D, Krstic D, Markovic V, Dunjic M
Vojnosanit Pregl 74 (9): 854-861
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2017,
Dianah ARSN, Hazmin SN, Umar R, Kamarudin MKA, Dagang AN
J Fund App Sci 9 (2S): 182-198
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Int J Adv Comput Sci Appl 8 (11): 223–235
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2017,
Kurnaz C, Yildiz D, Karagöl S
2017 18th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering (ISEF) Book of Abstracts, Lodz, Poland. IEEE: S. 1-2; ISBN 978-1-5386-1662-8
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2017,
Ostafin M, Miernik A, Drozdz T, Nawara P, Gliniak M, Kielbasa P, Tabor S
2017 Progress in Applied Electrical Engineering (PAEE), Koscielisko, Poland. IEEE: S. 1-5; ISBN 978-1-5386-1529-4
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2017,
Mittal L, Raman V, Camarillo IG, Garner AL, Fairbanks AJ, Dunn GA, Sundararajan R
2017 IEEE Conference on Electrical Insulation and Dielectric Phenomenon (CEIDP), Fort Worth, TX, USA. IEEE: S. 596-599; ISBN 978-1-5386-1195-1
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2017,
Mi Y, Xu J, Tang X, Yao C, Li C
IEEE Trans Dielectr Electr Insul 24 (6): 3985 - 3994
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2017,
Dong F, Liu Z, Zhang J, Fang J, Guo J, Zhang J, Fang J, Zhang Y
2017 IEEE International Conference on Plasma Science (ICOPS), Atlantic City, NJ, USA. IEEE: S. 1; ISBN 978-1-5090-5244-8
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2017,
Wang F, Wang Y, Huang T, Guo F, Liu J, Song Z, Weng Z, Wang Z, Wang Z
2017 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), Shanghai, China. IEEE: S. 174-177; ISBN 978-1-5386-1082-4
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2017,
Jovicic K, Koprivica M, Kuzle I, Neskovic N, Neskovic A
[2017 25th Telecommunication Forum (TELFOR)], Belgrade, Serbia. IEEE: S. 1-2; ISBN 978-1-5386-3074-7