Die folgenden Begriffe wurden einbezogen:
電磁界強度, Feldstärke, "field intensity", "field strength"
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2019,
Frigura-Iliasa M, Olariu AF, Baloi FI, Frigura-Iliasa FM, Vatau D, Petrenci RC
2019 International Conference on ENERGY and ENVIRONMENT (CIEM), Timisoara, Romania. IEEE: 82-85; ISBN 978-1-7281-1533-7
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2019,
Frigura-Iliasa M, Baloi FI, Olariu AF, Vatau D, Petrenci RC, Bran M
2019 International Conference on ENERGY and ENVIRONMENT (CIEM), Timisoara, Romania. IEEE: 86-89; ISBN 978-1-7281-1533-7
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2019,
Rohde M, Ziebart J, Kirschstein T, Sellmann T, Porath K, Kühl F, Delenda B, Bahls C, van Rienen U, Bader R, Köhling R
Front Bioeng Biotechnol 7: 422
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2019,
Vaessen EMJ, Timmermans RAH, Tempelaars MH, Schutyser MAI, den Besten HMW
Sci Rep 9: 19990
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2019,
Li C, Liu C, Yang L, He L, Wu T
Biomed Res Int 2019: 9461018
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2019,
Michalowska J, Jozwik J, Tofil A
2019 IEEE 5th International Workshop on Metrology for AeroSpace (MetroAeroSpace), Torino, Italy. IEEE: 366-370; ISBN 978-1-7281-1345-6
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2019,
Lorenzo MF, Thomas SC, Kani Y, Hinckley J, Lee M, Adler J, Verbridge SS, Hsu FC, Robertson JL, Davalos RV, Rossmeisl Jr JH
Cancers 11 (12): E1850
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2019 Open Innovations (OI), Cape Town, South Africa. IEEE: 222-225; ISBN 978-1-7281-3465-9
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2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 162-165; ISBN 978-1-7281-1639-6
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2019,
Rubin AE, Usta OB, Schloss R, Yarmush M, Golberg A
Adv Wound Care 8 (4): 136-148
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2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
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2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 48-51; ISBN 978-1-7281-1639-6
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2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 334-337; ISBN 978-1-7281-1639-6
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Strahlenschutzkommission (SSK),
1-65
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2019,
Wen F, Li Q, Li R, Liu L, Wu T
2019 IEEE Innovative Smart Grid Technologies - Asia (ISGT Asia), Chengdu, China. IEEE: 4117-4121; ISBN 978-1-7281-3521-2
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2019,
Bechet AC, Helbet R, Miclaus S, Bouleanu I, Sarbu A, Bechet P
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: 1025-1029; ISBN 978-1-7281-0595-6
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2019,
Abasi S, Aggas JR, Venkatesh N, Vallavanatt IG, Guiseppi-Elie A
Biosens Bioelectron 147: 111793
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2019,
Schukro C, Puchner SB
Eur J Radiol 118: 96-100
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2019,
Gomez-Tames J, Tarnaud T, Miwa K, Hirata A, Van de Steene T, Martens L, Tanghe E, Joseph W
IEEE Trans Electromagn Compat 61 (6): 1944 - 1952
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2019,
Perov S, Rubtsova N, Balzano Q
Bioelectromagnetics 40 (8): 578-587
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2019,
Hensen B, Kägebein U, Gutberlet M, Ringe KI, Vo-Chieu VD, Stucht D, Speck O, Vick R, Wacker F, Pannicke E
Biomed Tech 64 (4): 373-382
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Exp Brain Res 237 (12): 3071-3088
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2019,
De Angelis A, Denzi A, Merla C, Andre FM, Garcia-Sanchez T, Mir LM, Apollonio F, Liberti M
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: 134-137; ISBN 978-1-5386-1312-2
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Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std C95.1-2019: 1-312, ISBN 978-1-5044-5548-0
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Top Magn Reson Imaging 28 (3): 145-158