Die folgenden Begriffe wurden einbezogen:
電磁気の, elektromagnetisch, electromagnetic
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2023,
Brazdzionis J, Radwan MM, Thankam F, Mendoza Mari Y, Baron D, Connett D, Agrawal DK, Miulli DE
Cureus 15 (8): e43774
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2023,
Islam MS, Islam MM, Rahman MM, Islam K
Vet Med Sci 9 (6): 2648-2659
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2023,
Odutola MK, van Leeuwen MT, Bruinsma FJ, Benke G, Turner MC, Trotman J, Turner J, Seymour JF, Prince HM, Milliken ST, Tiley C, Hertzberg M, Roncolato F, Opat S, Lindeman R, Verner E, Underhill CR, Cardis E, Giles G, Vajdic CM
Occup Environ Med 80 (10): 599-602
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2023,
Diao Y, Liu L, Deng N, Lyu S, Hirata A
Phys Med Biol 68 (20): 205014
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2023,
Takahari K, Oka T, Sekihara T, Ozu K, Akazawa Y, Nakamura D, Mizote I, Ohtani T, Hikoso S, Sakata Y
JACC Case Rep 21: 101981
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2023,
Mahfuz MMH, Islam MR, Habaebi MH, Malek NA, Sami MW
2023 9th International Conference on Computer and Communication Engineering (ICCCE), Kuala Lumpur, Malaysia. IEEE: 394-399; ISBN 9798350325225
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2023,
Huang Z, Ito M, Zhang S, Toda T, Takeda JI, Ogi T, Ohno K
Ecotoxicol Environ Saf 264: 115482
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2023,
Ayesha S, Abideen Z, Haider G, Zulfiqar F, El-Keblawy A, Rasheed A, Siddique KHM, Khan MB, Radicetti E
Plant Stress 9: 100198
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2023,
Jovanović UZ, Krstić DD, Zigar DN, Malenović-Nikolić JR, Cvetanović SG
Therm Sci 27 (3B): 2433-2442
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2023,
Wyszkowska J, Maliszewska J, Gas P
Appl Sci 13 (17): 9893
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2023,
Sun C, Zhu L, Qin H, Su H, Zhang J, Wang S, Xu X, Zhao Z, Mao G, Chen J
Ecotoxicol Environ Saf 264: 115472
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2023,
Tüfekci KK, Kaplan AA, Kaya A, Alrafiah A, Altun G, Aktaş A, Kaplan S
Int J Neurosci 133 (12): 1424-1436
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2023,
Parsa N, Sanphuang V
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 655; ISBN 9798350309775
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2023,
Boukabou I, Rupanetti D, Kaabouch N, Foust L
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 413-418; ISBN 9798350309775
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2023,
Alzahed A, Lemay E, Zhuk M, Gajda GB, McNamee JP, McGarr GW
IEEE Access 11: 100343-100354
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2023,
Perez FP, Rahmani M, Morisaki J, Amran F, Bakri S, Halim A, Dsouza A, Yusuff NM, Farhan A, Maulucci J, Rizkalla M
J Biosci Med 11 (2): 177-185
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2023,
Asadi R, Aliakbarian H, Sahraei A, Yazdani R, Kim DH
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), Grand Rapids, MI, USA. IEEE: 608-613; ISBN 9798350309775
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2023,
Brzozek C, Karipidis K
Public Health Res Pract 33 (3): 3332325
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2023,
Igarashi S, Chida K, Matsuda T, Takeda K, Hayakawa S, Tsutsui S, Fujiwara S, Kubo Y, Sasaki M, Ogasawara K
Neuroradiology 65 (12): 1809-1812
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2023,
Islam MS, Pal A, Noor MS, Sazzad IU
Environ Monit Assess 195 (10): 1190
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2023,
Tian R, Zhang JQ, Lu M
Arch Electr Eng 72 (2): 483-501
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2023,
Wessapan T, Rattanadecho P, Somsuk N, Yamfang M, Guptasa M, Montienthong P
Energies 16 (16): 5925
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2023,
Yang X, Zheng J, Chen J
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI), Portland, OR, USA. IEEE: 849-850; ISBN 978-1-6654-4229-9
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2023,
Yildiz G, Farhat I, Farrugia L, Zarb Adami K, Yilmaz T, Akduman I
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI), Portland, OR, USA. IEEE: 1263-1264; ISBN 978-1-6654-4229-9
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2023,
Liu S, Onishi T, Taki M, Watanabe S
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI), Portland, OR, USA. IEEE: 443-444; ISBN 978-1-6654-4229-9
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2023,
Duque JL, Urbina R, Perez MR, Araque JL
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI), Portland, OR, USA. IEEE: 1875-1876; ISBN 978-1-6654-4229-9
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2023,
Liang P, Li Z, Li J, Wei J, Li J, Zhang S, Xu S, Liu Z, Wang J
Front Public Health 11: 1138118
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2023,
Cantu JC, Barnes RA, Gamboa BM, Keister AS, Echchgadda I, Ibey BL
AMB Express 13: 95
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2023,
Jiang F, Henry KR, Bhusal B, Sanpitak P, Webster G, Popescu A, Laternser C, Kim D, Golestanirad L
Diagnostics 13 (17): 2847
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2023,
Markus I, Ohayon E, Constantini K, Geva-Kleinberger K, Ibrahim R, Ruban A, Gepner Y
Int J Mol Sci 24 (17): 13463
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2023,
Čėsnienė I, Miškelytė D, Novickij V, Mildažienė V, Sirgedaitė-Šėžienė V
Plants 12 (17): 3048
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2023,
Pesare E, Vicenti G, Kon E, Berruto M, Caporali R, Moretti B, Randelli PS
J Orthop Traumatol 24: 47
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2023,
Guo H, Kang L, Qin W, Li Y
Altern Ther Health Med 29 (8): 75-81
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2023,
Vivarelli C, Censi F, Calcagnini G, De Ruvo E, Calò L, Mattei E
Int J Environ Res Public Health 20 (5): 4512
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2023,
Ramzan M, Khaleghi A, Fang X, Wang Q, Neumann N, Plettemeier D
IEEE Trans Biomed Circuits Syst 17 (3): 621-632
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J Cosmet Dermatol 22 (1): 193-199
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2023,
Reddy IVAK, Elmaadawy S, Furlani EP, Jornet JM
Sci Rep 13: 14643
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2023,
Hasselman DJ, Hemery LG, Copping AE, Fulton EA, Fox J, Gill AB, Polagye B
Sci Total Environ 904: 166801
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Scientific Committee on Health, Environmental and Emerging Risks (SCHEER),
1-56
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2023,
Kopacz T, Schiffarth AM, Wuschek M, Bornkessel C
Landesamt für Natur, Umwelt und Verbraucherschutz Nordrhein-Westfalen (LANUV),
LANUV-Fachbericht 143: 1-138
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2023,
Prasertwitayakij N, Komolmis T, Gunaparn S, Pisespongsa C, Phrommintikul A, Wongcharoen W, Nantsupawat T
Expert Rev Med Devices 20 (11): 973-977
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2023,
Ejaz A, Jabeen I, Khan ZU, Alomainy A, Aljaloud K, Alqahtani AH, Hussain N, Hussain R, Amin Y
Micromachines 14 (6): 1169
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2023,
Muramatsu D, Kodama M
AIP Adv 13 (8): 085022
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Dermatologie 74 (10): 759-764
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2023,
Nedelcu MN, Petrescu T
UPB Sci Bull, Series C: Electr Eng Comput Sci 85 (3): 297-306
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Microw and Opt Tech Letters 65 (12): 3204-3210
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2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM), Harbin, China. IEEE: 29-30; ISBN 9798350336757
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2023,
Ding Y, Yang Y, Xu F, Tan Z, Liu X, Shao X, Kang F, Yan Z, Luo E, Wang J, Luo Z, Cai J, Jing D
iScience 26 (9): 107605
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2023,
Woo MK, DelaBarre L, Waks M, Lagore R, Kim J, Jungst S, Eryaman Y, Ugurbil K, Adriany G
IEEE Trans Med Imaging 42 (9): 2643-2652
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2023,
Liporace F, Cavagnaro M
2023 17th European Conference on Antennas and Propagation (EuCAP), Florence, Italy. IEEE: 1-4; ISBN 978-1-6654-7541-9