Die folgenden Begriffe wurden einbezogen:
電磁両立性, "elektromagnetische Verträglichkeit", EMC, EMV, "electromagnetic compatibility"
-
2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 449-452; ISBN 978-4-88552-287-1
-
2014,
Nagaoka T, Watanabe S, Niwa T
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 190-193; ISBN 978-4-88552-287-1
-
2014,
Sasaki K, Nagaoka T, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 537-540; ISBN 978-4-88552-287-1
-
2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 186-189; ISBN 978-4-88552-287-1
-
2014,
Kim M, Kim S, Ahn S, Chun Y, Park S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 426-429; ISBN 978-4-88552-287-1
-
2014,
Wiart J, Conil E, Varsier N, Sarrebourse T, Hadjem A, Martens L, Wermeeren G, Corre Y
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 635-637; ISBN 978-4-88552-287-1
-
2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 166-169; ISBN 978-4-88552-287-1
-
2014,
Chakarothai J, Suzuki Y, Taki M, Kojima M, Sasaki K, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 182-185; ISBN 978-4-88552-287-1
-
2014,
Cabot E, Zastrow E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 237-240; ISBN 978-4-88552-287-1
-
2014,
Choi DG, Kim KH, Jang JD, Chung SY, Gimm YM
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 638-641; ISBN 978-4-88552-287-1
-
2014,
Kim HS, Lee YH, Choi HD, Lee AK, Lee YS, Pack JK, Kim N, Ahn YH
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 170-173; ISBN 978-4-88552-287-1
-
2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 832-835; ISBN 978-4-88552-287-1
-
2014,
Neufeld E, Kuster N
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 230-233; ISBN 978-4-88552-287-1
-
2014,
Laakso I, Shimamoto T, Hirata A, Feliziani M
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 430-433; ISBN 978-4-88552-287-1
-
2014,
Kang WG, Alexander Z, Jun HY, Park YH, Pack JK
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 198-201; ISBN 978-4-88552-287-1
-
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 194-197; ISBN 978-4-88552-287-1
-
2014,
Iwamoto T, Arima T, Uno T, Iwamoto T, Wake K, Fujii K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 529-532; ISBN 978-4-88552-287-1
-
2014,
Shimizu HO, Shimizu K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 162-165; ISBN 978-4-88552-287-1
-
2014,
Higashiyama J, Tarusawa Y
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 650-653; ISBN 978-4-88552-287-1
-
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 625-628; ISBN 978-4-88552-287-1
-
2014,
Miyaji Y, Shimada M, Mizuno Y, Naito K
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 621-624; ISBN 978-4-88552-287-1
-
2014 International Symposium on Electromagnetic Compatibility, Tokyo, Tokyo, Japan. IEEE: S. 206-209; ISBN 978-4-88552-287-1
-
Deutsche Kommission Elektrotechnik Elektronik Informationstechnik in DIN und VDE (DKE),
DIN EN 61786-1 VDE 0848-786-1:2014-10
-
2014,
Bieth F, Schunck T, Pinguet S, Delmote P
IEEE Trans Electromagn Compat 56 (4): 964-969
-
2014,
Seidman S, LaSorte N
IEEE Electromagn Compat Mag 3 (3): 49-54