Die folgenden Begriffe wurden einbezogen:
生存能力, Lebensfähigkeit, viability
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2024,
Alizadeh F, Saviz M, Khoraminia F, Talebipour A, Imani R, Shabani I
Bioelectromagnetics 45 (2): 33-47
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2024,
Tang N, Shu W, Wang HN
WIREs Cogn Sci 15 (1): e1666
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2024,
Barbora A, Rehamim S, Bohnick M, Firer MA, Yahalom A
Biotechnol J 19 (1): e2300277
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2024,
Amaechi BT, Mohseni S, Dillow AM, Abdul Azees PA, Movaghari Pour F, Kataoka Y, Restrepo MC
Eur J Dent 18 (1): 243-252
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2024,
Qiu YT, Chen Y, Tan HX, Su W, Guo QF, Gao Q
Cerebellum 23 (1): 243-254
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Eur Phys J Spec Top 232 (2): 261-268
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2023,
Quan Y, Huang Z, Wang Y, Liu Y, Ding S, Zhao Q, Chen X, Li H, Tang Z, Zhou B, Zhou Y
Mater Today Bio 23: 100831
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2023,
Mahendran K, Bharathi S, Shanmughavel S, Sona S
2023 International Conference on Emerging Research in Computational Science (ICERCS), Coimbatore, India. IEEE: S. 1-4; ISBN 9798350359770
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2023,
Hosur S, Karan SK, Priya S, Kiani M
2023 IEEE Biomedical Circuits and Systems Conference (BioCAS), Toronto, ON, Canada. IEEE: S. 1-5; ISBN 9798350300277
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2023,
Hueros V, Barrado A, Lázaro A, Fernández C
2023 IEEE 17th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG), Tallinn, Estonia. IEEE: S. 1-6; ISBN 9798350300055
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2023,
Bertuccio MP, Acri G, Ientile R, Caccamo D, Curro M
Biomedicines 11 (12): 3129
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2023,
Khan MA, Rahim AA, Sethi WT
2023 18th International Conference on Emerging Technologies (ICET), Peshawar, Pakistan. IEEE: S. 202-206; ISBN 9798350328189
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2023,
Nowak-Terpiłowska A, Górski R, Marszałek M, Wosiński S, Przesmycki R, Bugaj M, Nowosielski L, Baranowski M, Zeyland J
Ann Agric Environ Med 30 (4): 763-772
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2023,
McGraw M, Gilmer G, Bergmann J, Seshan V, Wang K, Pekker D, Modo M, Ambrosio F
J Tissue Eng Regen Med 2023: 5038317
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2023,
Frachini ECG, Silva JB, Fornaciari B, Baptista MS, Ulrich H, Petri DFS
Neurotox Res 42 (1): 2
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2023,
Fu S, Cai B, Yao G, Zhang P
Discov Med 35 (179): 1071-1076
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2023,
Waly MI, Smida A, AlJarallah NA, Ghayoula R, Negm AS, Muhammad S, Tiang JJ, Iqbal A
IEEE Access 11: 138325-138335
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2023,
Zhang T, Huang S, Lu Q, Song J, Teng J, Wang T, Shen Y
Front Psychol 14: 1298065
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2023,
Romanenko S, Sorolla A, Wallace VP
2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Montreal, QC, Canada. IEEE: S. 1-2; ISBN 9798350336610
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2023,
Wójcik-Piotrowicz K, Kaszuba-Zwoińska J, Piszczek P, Nowak B, Guzdek P, Gil K, Rokita E
Environ Toxicol Pharmacol 104: 104320
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2023,
Souiade L, Domingo-Diez J, Alcaide C, Gámez B, Gámez L, Ramos M, Serrano Olmedo JJ
Int J Mol Sci 24 (21): 15933
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2023,
Hambarde S, Manalo JM, Baskin DS, Sharpe MA, Helekar SA
Sci Rep 13: 19264
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2023,
Oh SJ, Maeng I, Son HY, Lee ES, Lee IM, Park KH
2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Montreal, QC, Canada. IEEE: S. 1-2; ISBN 9798350336610
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2023,
Szücs-Bencze L, Vékony T, Pesthy O, Szabó N, Kincses TZ, Turi Z, Nemeth D
J Intell 11 (10): 201
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2023,
Sauer N, Szlasa W, Szewczyk A, Novickij V, Saczko J, Baczyńska D, Daczewska M, Kulbacka J
Pharmaceuticals 16 (10): 1362
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2023,
Orlacchio R, Kolosnjaj-Tabi J, Mattei N, Lévêque P, Rols MP, Arnaud-Cormos D, Golzio M
Int J Mol Sci 24 (19): 14999
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2023,
Rahimi S, Ahrabi M, Samiei M, Roshangar L, Ahrabi B, Hashemi B, Shahi S, Rahimi Darehchi N
Iran Endod J 18 (4): 218-223
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2023,
Kapetanović A, Poljak D, Dodig H
2023 International Conference on Software, Telecommunications and Computer Networks (SoftCOM), Split, Croatia. IEEE: S. 1-5; ISBN 9798350301076
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2023,
Varghese C, Harvey X, Gharibans AA, Du P, Collinson R, Bissett IP, Stinear CM, O'Grady G, Paskaranandavadivel N
Colorectal Dis 25 (11): 2257-2265
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2023,
Sztafrowski D, Muraszko J, Jasiura A, Bryk P, Urbanek AK, Krasowska A
PLoS One 18 (10): e0291438
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2023,
Asadipour K, Zhou C, Yi V, Beebe SJ, Xiao S
Bioengineering 10 (9): 1069
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2023,
Esmaeilzadeh Kiabani N, Kazemi R, Hadipour AL, Khomami S, Kalloch B, Hlawitschka M
Psychiatry Res Neuroimaging 335: 111718
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2023,
Brazdzionis J, Radwan MM, Thankam F, Mendoza Mari Y, Baron D, Connett D, Agrawal DK, Miulli DE
Cureus 15 (8): e43774
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2023,
Huang Z, Ito M, Zhang S, Toda T, Takeda JI, Ogi T, Ohno K
Ecotoxicol Environ Saf 264: 115482
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2023,
Sun C, Zhu L, Qin H, Su H, Zhang J, Wang S, Xu X, Zhao Z, Mao G, Chen J
Ecotoxicol Environ Saf 264: 115472
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2023,
Ghosh D, Nandi A, Chakraborty U
2023 Photonics & Electromagnetics Research Symposium (PIERS), Prague, Czech Republic. IEEE: S. 1368-1374; ISBN 9798350312850
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2023,
Ergun DD, Ozsobaci NP, Yilmaz T, Ozcelik D, Kalkan MT
Electromagn Biol Med 42 (3): 123-132
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2023,
Guo S, Li W, Tian W, Wu Y
Tissue Eng Part A 29 (23-24): 620-632
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2023,
Koohestanidehaghi Y, Khalili MA, Fesahat F, Seify M, Mangoli E, Kalantar SM, Annarita Nottola S, Macchiarelli G, Grazia Palmerini M
Environ Pollut 336: 122411
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2023,
Peng MG, Iseri E, Simonyan A, Lam P, Kim T, Medvidovic S, Paknahad J, Machnoor M, Lazzi G, Gokoffski KK
Sci Rep 13: 13233
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2023,
Mariam John D, Ali T, Vincent S, Pathan S, Kumar P, Parveez Shariff BG
2023 International Telecommunications Conference (ITC-Egypt), Alexandria, Egypt. IEEE: S. 23-28; ISBN 9798350326079
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2023,
Zhang B, Li X, Zhou X, Lou C, Wang S, Lv H, Zhang G, Fang Y, Yin D, Shang P
iScience 26 (8): 107365
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J Clin Med 12 (14): 4648
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2023,
Moya-Gómez A, Font LP, Burlacu A, Alpizar YA, Cardonne MM, Brône B, Bronckaers A
Int J Mol Sci 24 (13): 11117
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2023,
Obrador E, Jihad-Jebbar A, Salvador-Palmer R, López-Blanch R, Oriol-Caballo M, Moreno-Murciano MP, Navarro EA, Cibrian R, Estrela JM
Cancers 15 (13): 3413
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2023,
Piszczek P, Wojcik-Piotrowicz K, Nowak B, Guzdek P, Novak P, Pytko-Polonczyk J, Gil K, Kaszuba-Zwoinska J
J Physiol Pharmacol 74 (2): 235-247
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2023,
Arifianto D, Astuti SD, Permatasari PAD, Arifah I, Yaqubi AK, Rulaningtyas R, Syahrom A
Micromachines 14 (4): 848
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2023,
McLaren JD, Schmaljohann H, Blasius B
Mov Ecol 11: 37
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2023,
Mehdizadeh R, Madjid Ansari A, Forouzesh F, Shahriari F, Shariatpanahi SP, Salaritabar A, Javidi MA
Sci Rep 13: 10845
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2023,
Khan A, Kumar Singh A, Singh AK
2023 International Conference on Microwave, Optical, and Communication Engineering (ICMOCE), Bhubaneswar, India. IEEE: S. 1-4; ISBN 9798350321616