Die folgenden Begriffe wurden einbezogen:
無線周波, Hochfrequenz, HF, "radio frequency", RF
-
2024,
Ben Ishai P, Davis D, Taylor H, Birnbaum L
Environ Res 243: 115038
-
2024,
Pal A, Ahmad D, Pal S, Ghazali AN
Wirel Netw 30 (6): 5187-5199
-
2024,
Choi CH, Webb A, Orzada S, Kelenjeridze M, Shah NJ, Felder J
IEEE Rev Biomed Eng 17: 351-368
-
2024,
Qiu YT, Chen Y, Tan HX, Su W, Guo QF, Gao Q
Cerebellum 23 (1): 243-254
-
2024,
Song Y, Xue X, Hua Y
Res Sports Med 32 (4): 545-555
-
2024,
Erken B, Edipoglu IS
Neuromodulation 27 (1): 135-140
-
2024,
Qin TZ, Wang X, Du JZ, Lin JJ, Xue YZ, Guo L, Lai PP, Jing YT, Zhang ZW, Ding GR
Int J Environ Health Res 34 (1): 316-327
-
Rev Environ Health 39 (2): 163-189
-
Aesthetic Plast Surg 48 (1): 4-7
-
2024,
Nyberg NR, McCredden JE, Weller SG, Hardell L
Rev Environ Health 39 (1): 47-64
-
2023,
Egorova SS, Kretov E, Lisachenko N, Glybovski SB, Solomakha GA
2023 Antennas Design and Measurement International Conference (ADMInC), Saint Petersburg, Russian Federation. IEEE: S. 45-47; ISBN 9798350326772
-
2023,
Yu Y, Qi Z, Yi D, Tang M, Ziolkowski RW
IEEE Sens J 23 (6): 5757-5765
-
2023,
Ramu MRS, Arunachalam K
IEEE J Electromagn RF Microw Med Biol 7 (4): 392-399
-
2023,
Shastri A, Siddiqui MG
2023 IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC), Venice, Italy. IEEE: S. 128-133; ISBN 9798350320619
-
2023,
Been Sayeed SY, Venkatakrishnan SB, Volakis JL, Raj PM
IEEE Trans Compon Packaging Manuf Technol 13 (3): 365-373
-
2023,
Althuwayb AA, Alibakhshikenari M, Virdee BS, Rashid N, Kaaniche K, Atitallah AB, Armghan A, Elhamrawy O, See CH, Falcone F
IEEE Access 11: 1039-1056
-
2023,
Rabhi R, Akbari-Chelaresi H, Olaimat M, Gharsallah A, Ramahi OM
2023 International Microwave and Antenna Symposium (IMAS), Cairo, Egypt. IEEE: S. 142-145; ISBN 978-1-6654-9076-4
-
2023,
Narayanan RP, Khaleghi A, Balasingharn I
NANOCOM 2023: Proceedings of the 10th ACM International Conference on Nanoscale Computing and Communication, Coventry, United Kingdom. Association for Computing Machinery, New York, NY, United States: S. 59-64; ISBN 9798400700347
-
2023,
Vidya KL, Srivastava S, Singh B, Kar SK
CNS Spectr 28 (4): 514-520
-
2023,
Taton G, Kacprzyk A, Rok T, Wasik A, Siwek M
Prz Elektrotechniczny 99 (1): 215-219
-
2023,
Shi T, Zhang M, Liu C, Deng Y, Chen P, Miao Y, Zeng J, Lu T, Liu X, Wu Y, Li C, Zeng Q
Journal of Environmental and Occupational Medicine 40 (2): 163-170
-
2023,
Poljak D, Susnjara A, Fisic A
J Commun Softw Syst 19 (1): 39-51
-
2023,
Hamadi HB, Ghnimi S, Latrach L, Benech P, Gharsallah A
Wirel Pers Commun 130 (1): 165-189
-
2023,
Trnka M, Gálik P, Kráľová E, Važan R
Commun - Sci Lett Univ Zilina 25 (1): G1-G6
-
2023,
Bakhtiary ZH, Saviz M
Int J Nonlinear Sci Numer Simul 24 (6): 2035-2046