Die folgenden Begriffe wurden einbezogen:
無線周波, Hochfrequenz, HF, "radio frequency", RF
-
2020,
Lu H, Guo J, Hong X, Chen A, Zhang X, Shen S
Medicine 99 (39): e22256
-
2020,
Dayan E, Rovatti P, Aston S, Chia CT, Rohrich R, Theodorou S
Plast Reconstr Surg Glob Open 8 (8): e2862
-
Bioelectron Med 6: 19
-
Cureus 12 (8): e9934
-
Dose Response 18 (3): 1559325820959557
-
2020,
Jayabharathy K, Ilakkia S
2020 7th International Conference on Smart Structures and Systems (ICSSS), Chennai, India. IEEE: S. 1-4; ISBN 978-1-7281-7228-6
-
2020,
Yang C, Xu H, Wang R, Liu Y, Wang S
Ann Palliat Med 9 (5): 3357-3365
-
2020,
Adda S, Aureli T, Coltellacci S, D’elia S, Franci D, Grillo E, Pasquino N, Pavoncello S, Suman R, Vaccarono M
IEEE Access 8: 171956-171967
-
2020,
Tariq RU, Ye M, Cao Z, He Y
2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Suzhou, China. IEEE: S. 1-3; ISBN 978-1-7281-6065-8
-
2020,
Supriya A, Ashok Kumar S, Shanmuganantham T
2020 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT), Bangalore, India. IEEE: S. 1-3; ISBN 978-1-7281-6829-6
-
2020,
Oh JY, Lee YJ, Kim EH
Technol Cancer Res Treat 19: 1533033820947481
-
2020,
Magiera A, Solecka J
Rocz Panstw Zakl Hig 71 (3): 251-259
-
2020,
Yahyazadeh A, Altunkaynak BZ
Biomed Environ Sci 33 (8): 593-602
-
2020,
Eggert T, Dorn H, Sauter C, Schmid G, Danker-Hopfe H
Environ Res 191: 110173
-
2020,
Lan Q, Zheng J, Chen J, Zhang M
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 270-275; ISBN 978-1-7281-7431-0
-
2020,
Yang R, Zheng J, Song S, Guo R, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 261-265; ISBN 978-1-7281-7431-0
-
2020,
Yang X, Zheng J, Chen J
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 266-269; ISBN 978-1-7281-7431-0
-
2020,
Rumeng T, Ying S, Tong W, Wentao Z
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: S. 659-662; ISBN 978-1-7281-7431-0
-
2020,
Psenakova Z, Beňová M, Lauková T
2020 ELEKTRO, Taormina, Italy. IEEE: S. 1-6; ISBN 978-1-7281-7543-0
-
2020,
Psenakova Z, Mydlova J, Benova M
2020 ELEKTRO, Taormina, Italy. IEEE: S. 1-6; ISBN 978-1-7281-7543-0
-
2020,
Gombarska D, Smetana M, Vaverka F, Drozdikova Z
2020 ELEKTRO, Taormina, Italy. IEEE: S. 1-5; ISBN 978-1-7281-7543-0
-
2020,
Halašová E, Tóthová B, Kmeťová Sivoňová M, Okajčeková T, Škovierová H, Špánik P, Pavelek M, Frivaldský M
2020 ELEKTRO, Taormina, Italy. IEEE: S. 1-6; ISBN 978-1-7281-7543-0
-
2020,
Jia Y, Shrestha N, Wang X, Wang T, Luo F
J Pain Res 13: 2093-2102
-
2020,
Suh DH, Hong ES, Kim HJ, Lee SJ, Kim HS
Dermatol Ther 33 (6): e14284
-
2020,
Pinto R, Sambucci M, Laudisi F, Nasta F, Lodato R, Altavista P, Lovisolo GA, Marino C, Pioli C
Environ Res 191: 110138